Thin Semiconductor Die Packages Using Recessed Cover and Adhesive Bonding
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Solution Overview
Problem
Conventional semiconductor die packages are large and costly due to the need for extensive support structures and encapsulants, which hinder miniaturization and increase manufacturing expenses.
Innovation Solution
The use of a cover with recesses to accommodate conductive couplers and a removable support member to reduce package thickness, eliminating the need for a base and encapsulant, while maintaining protection and connectivity through an adhesive, allows for a more compact and cost-effective design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional support structures and encapsulants are used, then protection and connectivity are maintained, but package size and manufacturing cost increase
Solution Approach 1:
The patent removes the base and encapsulant from the conventional package structure, retaining only the essential cover and support member components. This extraction eliminates unnecessary material while preserving the core protective and structural functions, directly reducing package volume and manufacturing cost.
Solution Approach 2:
The package is divided into discrete functional components: a cover with recesses for conductive couplers, a removable support member, and adhesive layers. This segmentation allows each component to be optimized independently and facilitates assembly/disassembly, reducing overall package complexity and size.
2Stability of the object's composition
If conventional support structures are used, then structural stability is maintained, but package thickness increases
Solution Approach 1:
The support member is designed as a thin, flexible structure that provides necessary structural support without adding significant thickness. The thin-film approach maintains structural stability while enabling reduced package thickness compared to conventional rigid support structures.
Solution Approach 2:
The support member incorporates recesses that accommodate conductive couplers in the vertical dimension, allowing the package thickness to be minimized while still providing structural support and electrical connectivity pathways.
3Reliability
If extensive encapsulants are used, then protection is provided, but thermal stress and manufacturing cost increase
Solution Approach 1:
The encapsulant is completely removed from the package structure, eliminating the source of thermal stress that arises from differential thermal expansion between the encapsulant and other package components. Protection is maintained through the cover and adhesive layers instead.
Solution Approach 2:
The package uses composite material strategies with the cover, support member, and adhesive layers having compatible thermal expansion properties, reducing thermal stress while maintaining protective functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thinner, more versatile package with improved heat dissipation and reduced thermal stresses, enhancing reliability and integration with compact electronic devices.
Implementation Method 1
The cover can be joined to the conductive structure and/or die with an adhesive
Implementation Method 2
The cover can include a recess that receives at least a portion of the conductive couplers
Implementation Method 3
A temporary support member can be attached to a second surface of the die and a second surface of the conductive structure to maintain the die and the conductive structure in a coplanar relationship
Data Source
AI summary
Thin semiconductor die packages and associated systems and methods are disclosed. A package in accordance with a particular embodiment includes a semiconductor die having die bond sites, a conductive structure positioned proximate to the semiconductor die and having first bond sites and second bond sites spaced apart from the first bond sites, and conductive couplers connected between the first bond sites of the conductive structure and the die bond sites of the semiconductor die. A cover can be positioned adjacent to the semiconductor die, and can include a recess in which the conductive couplers are received.