Thin Active Solder Foil for Low-Stress Metal-Ceramic Bonding
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Solution Overview
Problem
Existing solder materials for bonding metal layers to ceramic layers in metal-ceramic substrates are inefficient in terms of material usage and thermomechanical stress resistance, leading to potential damage and reduced service life of the substrates.
Innovation Solution
A solder material comprising a base material and an active metal, formed as a thin foil with a total thickness less than 25 μm, specifically designed to provide a permanent and stable bond between metal and ceramic layers by minimizing material usage and optimizing active metal distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional solder materials with greater thickness are used for bonding metal layers to ceramic layers, then the bonding strength and reliability are improved, but the material costs increase and the thermomechanical stress resistance deteriorates
Solution Approach 1:
The invention changes the thickness parameter of the solder material from conventional greater thickness to specifically less than 25 μm. This parameter change optimizes the balance between bonding strength and material cost, achieving reliable bonding while reducing material consumption and costs.
2Strength
If conventional solder materials with greater thickness are used for bonding metal layers to ceramic layers, then the bonding strength is improved, but the thermomechanical stress resistance deteriorates
Solution Approach 1:
The invention changes the thickness parameter to less than 25 μm, which reduces the constraint effect on thermomechanical stress while maintaining sufficient bonding strength. This allows the solder material to better accommodate thermal expansion differences between metal and ceramic layers.
3Loss of substance
If solder material thickness is reduced to minimize material usage, then material costs are reduced, but the bonding strength may deteriorate
Solution Approach 1:
The invention identifies less than 25 μm as the optimal thickness parameter that maintains sufficient bonding strength while minimizing material usage. This parameter change ensures that the solder material is thin enough to reduce costs but thick enough to provide reliable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin solder material effectively achieves a permanent and stable bond between metal and ceramic layers, reducing thermomechanical stresses and enhancing the service life of metal-ceramic substrates while minimizing material costs.
Implementation Method 1
This active metal, which is for example at least one element from the group Hf, Ti, Zr, Nb, Ce, establishes a connection between the solder alloy and the ceramic by chemical reaction
Implementation Method 2
The thin solder material effectively achieves a permanent and stable bond between metal and ceramic layers, reducing thermomechanical stresses
Data Source
AI summary
A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising:a base material andan active metal,wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), andwherein the foil has a total thickness (GD) which is less than 50 μm, preferably less than 25 μm and particularly preferably less than 15 μm.