Thin Substrate Handling and Drying Without Roller Interference
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Solution Overview
Problem
Large and thin substrates are prone to bending and deformation during horizontal transporting mechanisms, which can interfere with processing equipment, hindering stable processing in cleaning and drying processes.
Innovation Solution
A substrate processing apparatus with a support portion for maintaining a horizontal posture, an elevating portion for lowering and raising the substrate, a gripping portion for secure handling, and a gas nozzle for drying, allowing for stable processing without the use of rollers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a horizontal transporting mechanism using rollers is used for cleaning and drying, then the substrate can be transported without rotational cleaning, but thin substrates may bend and deform, interfering with the rollers and hindering normal transportation
Solution Approach 1:
The patent replaces the roller-based mechanical transporting system with a suction-based holding system. The suction holes create negative pressure to hold the substrate in place during horizontal transportation, eliminating the mechanical contact that causes bending and deformation of thin substrates.
Solution Approach 2:
The patent uses pneumatic pressure differential through suction holes to hold and transport the substrate. By creating a pressure difference between the suction holes and the surrounding atmosphere, the substrate is securely held during horizontal transportation without physical contact from rollers.
2Productivity
If thin substrates are processed with horizontal transporting mechanisms, then processing can be performed, but the substrates are likely to bend and deform, causing interference with processing structures
Solution Approach 1:
The patent replaces mechanical roller contact with pneumatic suction holding, eliminating the mechanical forces that cause substrate deformation. This allows thin substrates to be processed while maintaining their original shape and dimensional accuracy.
Solution Approach 2:
The patent changes the physical state of substrate holding from mechanical contact to pneumatic pressure differential. By controlling the suction pressure, the substrate is held firmly during processing without the mechanical stresses that would compromise manufacturing precision.
3Ease of operation
If rollers are used for substrate transportation, then horizontal transporting is enabled, but thin substrates may interfere with the rollers during the transporting process
Solution Approach 1:
The patent eliminates the roller mechanism entirely and replaces it with a suction-based holding system. The substrate is held by negative pressure from suction holes, allowing smooth horizontal transportation without any mechanical contact that could cause interference or deformation.
Solution Approach 2:
The patent introduces a pneumatic field as an intermediary between the transporting mechanism and the substrate. The suction holes create a pressure field that holds the substrate without physical contact, preventing interference during transportation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable processing of thin substrates by maintaining their horizontal posture throughout the processing and drying stages, preventing interference with equipment and ensuring efficient handling.
Implementation Method 1
a first nozzle configured to emit a gas onto the substrate, gripped by the gripping portion, to dry the substrate
Data Source
AI summary
The present invention relates to a substrate processing apparatus for processing a substrate with a processing liquid. The substrate processing apparatus according to one embodiment includes: a support portion having a placement surface on which a substrate is placed in a horizontal posture; a processing tank configured to supply a processing liquid to the substrate and process the substrate; an elevating portion configured to raise and lower the support portion in order to lower the substrate into the processing tank and raise the substrate from the processing tank; a gripping portion configured to grip a periphery of the substrate supported by the support portion above the processing tank, and receive the substrate from the support portion; and a first nozzle configured to emit a gas onto the substrate, gripped by the gripping portion, to dry the substrate.


