Thin Substrate Electronic Device for Lightweight Multi-Function Integration
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Solution Overview
Problem
The challenge is to create electronic devices that are both thin and lightweight while maintaining multiple integrated functions, as increasing functionality often complicates achieving these goals.
Innovation Solution
The solution involves a manufacturing method for electronic devices that includes a display panel with a display medium layer between substrates and a viewing angle switchable panel with a switching medium layer, where at least one substrate has a thickness of 5 μm to 50 μm, allowing for bonding to form a thin and lightweight device. This method involves forming substrates using various materials and techniques like coating and laser lift-off to achieve the desired thickness and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple functions are integrated into a single electronic device, then functionality and versatility are improved, but device thickness and weight increase
Solution Approach 1:
The device is divided into multiple functional layers including display panel, touch sensor panel, and privacy panel, each performing specific functions. This segmentation allows independent optimization of each layer's thickness and material selection, enabling multiple functions to be integrated without proportionally increasing overall device weight.
Solution Approach 2:
The patent employs thin-film technologies throughout the device structure, with substrate thicknesses ranging from 5-50 μm for certain layers. These thin films provide the necessary mechanical support and functional properties while minimizing weight, allowing multiple functional layers to be stacked without significant weight increase.
2Adaptability or versatility
If multiple functions are integrated into a single electronic device, then functionality and versatility are improved, but device thickness increases
Solution Approach 1:
The device is divided into multiple functional layers including display panel, touch sensor panel, and privacy panel, each performing specific functions. This segmentation allows independent optimization of each layer's thickness and material selection, enabling multiple functions to be integrated without proportionally increasing overall device thickness.
Solution Approach 2:
The patent employs thin-film technologies throughout the device structure, with substrate thicknesses ranging from 5-50 μm for certain layers. These thin films provide the necessary mechanical support and functional properties while minimizing thickness, allowing multiple functional layers to be stacked without significant thickness increase.
3Length of stationary object
If substrate thickness is reduced to 5 μm to 50 μm, then device thinness and light weight are achieved, but manufacturing precision and structural integrity become more difficult to maintain
Solution Approach 1:
The patent specifies precise thickness parameters for substrates (5-50 μm for certain layers) and employs controlled manufacturing processes including coating methods and laser lift-off techniques. By carefully controlling fabrication parameters and using specialized processes designed for thin-film work, the patent achieves the required thickness reduction while maintaining manufacturing precision and structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of electronic devices that are both thin and lightweight, addressing the challenge of integrating multiple functions while maintaining structural integrity and functionality, such as display and privacy features.
Implementation Method 1
forming the third substrate on the first carrier substrate by a coating method so as to form a first substrate structure
Implementation Method 2
separating the first carrier substrate and the third substrate in the first substrate structure to form the viewing angle switchable panel
Data Source
AI summary
An electronic device includes a display panel and a viewing angle switchable panel disposed on the display panel. The display panel includes: a first substrate; a second substrate disposed opposite to the first substrate; and a display medium layer disposed between the first substrate and the second substrate. The viewing angle switchable panel is provided with: a third substrate; a fourth substrate disposed opposite to the third substrate; and a switching medium layer disposed between the third substrate and the fourth substrate. At least one of the third substrate and the fourth substrate has a thickness of 5 μm to 50 μm.


