Thin Substrate Package With Lead Frame Support for Stable Handling
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Solution Overview
Problem
The challenge in semiconductor packaging lies in handling and stabilizing thin substrates, which become flimsy and difficult to manage, especially during assembly of large strips like 240×74 millimeters, leading to unusable substrates that cannot meet the demand for smaller, faster, and higher-performing semiconductor packages.
Innovation Solution
Incorporating lead frame portions as stiffeners or supports within the package to stabilize the thin organic laminate substrates, allowing them to act as a center piece between lead frame portions, thereby enhancing stability and reducing strip handling issues, resulting in a smaller and more efficient semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the substrate thickness is reduced to achieve smaller semiconductor packages, then the package size is reduced, but the substrate becomes flimsy and difficult to handle during assembly
Solution Approach 1:
The substrate is segmented into multiple sections with recesses formed between adjacent sections. These recesses create natural support points that prevent the thin substrate from bending or warping during handling, while still allowing the overall package size to be reduced.
Solution Approach 2:
A support structure is introduced as an intermediary element between the thin substrate and the handling process. The support structure spans across the recesses and provides mechanical reinforcement to the substrate during assembly operations, enabling easy handling despite the reduced substrate thickness.
2Length of stationary object
If the substrate thickness is reduced to create thinner packages, then the package profile is reduced, but the substrate stability during packaging deteriorates
Solution Approach 1:
The substrate is divided into multiple sections with recesses between them, creating a segmented structure that inherently provides stability. Each section is supported independently, preventing excessive deflection or warping even when the overall substrate thickness is reduced.
Solution Approach 2:
The support structure is positioned locally at specific points corresponding to the recesses between substrate sections. This localized support provides maximum stability where needed most, allowing the substrate to remain thin in non-critical areas while maintaining overall stability during packaging.
3Ease of operation
If large substrate strips are used to meet current packaging demands, then the substrate is easier to handle, but the substrate becomes unusable due to handling issues and cannot meet demand for smaller packages
Solution Approach 1:
The large substrate strip is segmented into multiple smaller sections with recesses between them. This segmentation allows the strip to be handled more easily as a larger structure while the recesses prevent bending and warping issues that would make it unusable. The segmented design also enables the final packages to be smaller while maintaining handling ease.
Solution Approach 2:
The support structure acts as an intermediary that enables the use of large substrate strips for smaller package applications. By providing mechanical reinforcement through the support structure spanning the recesses, large strips can be handled easily and then processed into smaller packages without suffering from the flimsiness that would normally prevent this.
Data Source
AI summary
The present disclosure is directed to a thin substrate package and a lead frame method of fabricating the semiconductor package. The semiconductor package includes a first lead frame portion and a second lead frame portion. A substrate is positioned in a center opening between the first lead frame portion and the second lead frame portion, the substrate having a thickness less than or equal to 0.10-millimeters (mm). A first die having a plurality of wires is positioned on the substrate by an adhesive. A molding compound covers the first and second lead frame portions, the substrate, and the first die.