Thin Transport Support With Adhesive Tape For Electronic Module Handling
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Solution Overview
Problem
The challenge in microelectronics is to efficiently test and transport electronic modules during the fabrication of integrated circuits, requiring a method that securely positions and connects these modules for testing while allowing for easy separation and repositioning without damaging the modules.
Innovation Solution
A thin transporting support with non-permanent gluing means, such as adhesive tape, is used to securely hold electronic modules in place, allowing for temporary attachment and detachment, and electrical connections are established through contact means for testing, enabling sequential or grouped testing and transportation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If non-permanent gluing means are used to hold electronic modules, then ease of separation is improved, but holding strength deteriorates
Solution Approach 1:
The patent uses non-permanent gluing means that can dynamically change their bonding characteristics. The adhesive allows modules to be firmly held during transport and testing, then easily released when needed. This dynamic property resolves the contradiction between strong holding and easy separation.
Solution Approach 2:
The gluing means changes its bonding parameters based on operational requirements. During transport and testing phases, the adhesive maintains strong bonding; during separation phases, the bonding is easily reversible. This parameter change capability allows the system to achieve both strong holding and easy separation.
2Reliability
If electronic modules are securely positioned for testing, then testing reliability is improved, but module damage risk increases
Solution Approach 1:
The support structure is divided into multiple receiving openings that independently hold individual modules. This segmentation allows each module to be securely positioned without excessive force being applied to any single module, reducing damage risk while maintaining testing reliability.
Solution Approach 2:
The non-permanent gluing means adjusts its bonding parameters to provide secure positioning during testing while allowing easy release. This prevents damage that could occur with permanent or overly strong bonding methods, while still ensuring reliable module positioning for accurate testing.
3Device complexity
If thin support structure is used for transport, then device complexity is reduced, but structural strength deteriorates
Solution Approach 1:
The patent employs a thin support structure that provides adequate strength for transporting and testing electronic modules while maintaining simplicity. The thin design reduces device complexity and material usage while the non-permanent gluing means compensates for the reduced structural strength, ensuring modules remain securely positioned.
Solution Approach 2:
The non-permanent gluing means acts as an intermediary between the thin support structure and the electronic modules. It compensates for the limited structural strength of the thin support by providing additional bonding force, allowing the use of a simple, thin support without compromising module security during transport and testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for efficient and secure testing and transportation of electronic modules by ensuring reliable attachment and detachment, facilitating the testing process while minimizing damage and enabling flexible handling and electrical connectivity.
Implementation Method 1
non-permanent gluing means, such as adhesive tape, is used to securely hold electronic modules in place
Data Source
AI summary
Electronic modules are transported with respect to equipment for manipulating and testing electronic modules. The transport is formed from a thin support having openings for receiving electronic modules. A locating mechanism associated with the thin support serves to locate the support relative to transport and testing equipment. A mechanism is further provided for holding the received electronic modules within the openings during transport and testing.