Thin Thermal Interface Material with Transfer Film
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Solution Overview
Problem
Thermal interface materials with thick foils increase thermal impedance due to longer heat conduction paths, and thin metal layers or transfer films are fragile and not self-supporting, making them unsuitable for effective heat transfer between heat-generating components and heat sinks.
Innovation Solution
The use of thin metallization, metal layers with polymer coatings, or dry materials with thicknesses of 0.0005 inches or less, which provide improved thermal performance by reducing thermal impedance and allowing for better conformance to irregular surfaces, along with protective liners to prevent surface imperfections and facilitate easy release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thick foils are used as thermal interface materials, then structural strength and self-supporting capability are improved, but thermal impedance increases due to longer heat conduction paths
Solution Approach 1:
The patent uses thin metal layers or transfer films as intermediary thermal conduction elements between the heat-generating component and the thermal interface material. These thin intermediaries provide low thermal impedance pathways while the underlying thermal interface material provides structural support, resolving the contradiction between thickness-induced strength and thickness-induced thermal impedance.
2Loss of energy
If thin metal layers or transfer films are used, then thermal impedance is reduced and conformance to irregular surfaces is improved, but fragility and lack of self-supporting capability worsen
Solution Approach 1:
The patent combines thin metal layers or transfer films with a thermal interface material substrate to create a composite structure. The thin metal layer provides low thermal impedance and surface conformance, while the thermal interface material provides mechanical strength and self-supporting capability, merging the advantages of both components to resolve the fragility issue.
3Loss of energy
If thin thermal interface materials are used, then thermal conductivity is enhanced and manufacturing costs are reduced, but handling difficulty increases due to lack of self-support
Solution Approach 1:
The patent employs thin metal layers or transfer films as intermediary elements that can be applied to the thermal interface material. These thin layers enhance thermal conductivity and reduce manufacturing costs while the thermal interface material substrate maintains handling ease through its self-supporting properties.
4Stability of the object's composition
If thick foils are used, then self-supporting capability is maintained, but thermal resistance increases compared to thinner materials
Solution Approach 1:
The patent segments the thermal interface system into multiple functional layers: thin metal layers or transfer films for low thermal resistance conduction paths, and thermal interface material for structural self-support. This segmentation allows each layer to optimize for its specific function, resolving the contradiction between thickness-related self-support and thickness-related thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin thermal interface materials offer enhanced thermal conductivity, easier handling, and reduced manufacturing and shipping costs, while maintaining product strength and allowing for clean release from components for servicing, with improved thermal resistance compared to thicker foils.
Implementation Method 1
establish a thermally conducting heat path defined by the heat-generating component, the thermal interface material assembly, and the heat sink
Implementation Method 2
allowing for better conformance to irregular surfaces
Data Source
AI summary
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.