Thin Vacuum Thermal Plane With Sintered Copper Hermetic Sealing
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Solution Overview
Problem
The miniaturization of electronic devices requires more nuanced thermal management techniques, as traditional methods like fans and large mechanical devices are inefficient for compact devices such as mobile phones and wearables, necessitating the development of thin yet effective thermal management solutions.
Innovation Solution
A thermal management plane comprising a hermetically sealed top and bottom casing with a copper seal created by sintering copper nanoparticles between them, optionally including a mesh layer, support structures, and a vacuum cavity, designed to provide high thermal conductivity while maintaining a thin profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional thermal management devices (fans, mechanical devices) are used, then thermal management effectiveness is improved, but device size and thickness increase
Solution Approach 1:
The patent replaces traditional mechanical thermal management devices (fans, pumps) with a nanoparticle-based thermal interface material that uses thermal conduction and phase change mechanisms. The nanoparticle paste is applied between heat-generating components and heat sinks, eliminating the need for moving mechanical parts while achieving effective heat transfer in a thin profile.
Solution Approach 2:
The patent changes the physical parameters of the thermal interface material by incorporating nanoparticles (metal, ceramic, or carbon-based) with high thermal conductivity into the paste formulation. This nanoparticle reinforcement significantly enhances the thermal conductivity parameter of the interface material, enabling effective heat transfer in a compressed, thin-state configuration.
2Reliability
If nanoparticle sintering is used to create hermetic seals, then seal quality and thermal conductivity are improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes the phase transition of copper nanoparticles from discrete particles to sintered bonds through controlled heating at 200-300°C. This phase transition process creates hermetic seals between casing components while simultaneously establishing high thermal conductivity pathways. The sintering process transforms the nanoparticle paste into a solid, bonded structure that provides both sealing and thermal management functions.
3Volume of moving object
If device miniaturization is pursued, then device compactness is improved, but thermal management effectiveness deteriorates
Solution Approach 1:
The patent creates a composite thermal interface material by combining nanoparticle fillers (metal, ceramic, or carbon) with a binder matrix. This composite structure provides both the mechanical properties needed for thin-film application and the high thermal conductivity required for effective heat transfer. The composite material can be compressed to thin dimensions while maintaining thermal performance through the nanoparticle network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves effective thermal management with high thermal conductivity while maintaining a thickness less than 200 microns, enhancing the performance of compact electronic devices by efficiently transferring heat.
Implementation Method 1
a copper seal between the top casing and the bottom casing created by sintering a plurality of copper nanoparticles disposed between the top casing and the bottom casing at a temperature between 200° C. and 300° C.
Data Source
AI summary
Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.