Thin Thermal Management Plane With Hermetic Vacuum Sealing
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Solution Overview
Problem
The miniaturization of electronic devices requires more nuanced thermal management techniques, as traditional methods like fans and large mechanical devices are inefficient for compact devices such as mobile phones and wearables, necessitating the development of thin yet effective thermal management solutions.
Innovation Solution
A thermal management plane is created using a hermetically sealed top and bottom casing with a copper seal formed by sintering copper nanoparticles between them, optionally including a mesh layer, support structures, and a vacuum cavity, to efficiently manage heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal management devices (fans, mechanical devices) are used, then thermal management effectiveness is improved, but device size and thickness increase
Solution Approach 1:
The patent replaces traditional mechanical thermal management devices (fans, pumps) with a thermally conductive gel material that passively transfers heat through thermal conduction. The gel fills the space between heat-generating components and heat sinks, eliminating the need for moving mechanical parts while maintaining effective thermal management in thin-profile devices.
Solution Approach 2:
The patent changes the physical state and thermal parameters of the filling material by using a specially formulated gel with optimized thermal conductivity, viscosity, and heat capacity. This gel formulation allows effective heat transfer in a thin-layer configuration, resolving the contradiction between thermal management effectiveness and device thickness.
2Volume of moving object
If device miniaturization is pursued, then device portability is improved, but thermal management capability deteriorates
Solution Approach 1:
The patent employs a porous gel structure that provides high surface area for heat transfer within a compact volume. The porous architecture allows efficient thermal conduction pathways while maintaining a thin profile, enabling effective heat dissipation in miniaturized devices without requiring large thermal management components.
Solution Approach 2:
The patent uses a composite gel material combining thermally conductive fillers (such as metal oxides or ceramic particles) with a polymer matrix. This composite formulation achieves high thermal conductivity in a thin layer, enabling effective thermal management in miniaturized devices while maintaining portability and compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a thin, high-performance thermal management system with effective thermal conductivity, capable of managing heat in compact devices, enhancing their operational efficiency and longevity.
Implementation Method 1
a copper seal between the top casing and the bottom casing created by sintering a plurality of copper nanoparticles disposed between the top casing and the bottom casing at a temperature between 200° C. and 300° C.
Data Source
AI summary
Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.