Thin Thermoelectric Module Assembly Without Solder or Supports
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Solution Overview
Problem
Existing thermoelectric conversion modules face challenges in thinning, material reduction, productivity improvement, and reliability enhancement, particularly in preventing diffusion and thermal stress, as well as strong bonding of thermoelectric elements and electrodes.
Innovation Solution
A method involving the creation of a self-standing integrated body with an insulator between P-type and N-type thermoelectric conversion material chips, followed by peeling and direct electrode connection, eliminating the need for supports and solder materials, allowing for collective and efficient production of thin thermoelectric conversion modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder materials and supports are used to bond thermoelectric elements and electrodes, then bonding strength and reliability are improved, but module thickness and material usage increase
Solution Approach 1:
The patent removes solder materials and support structures from the traditional thermoelectric module assembly, replacing them with a direct bonding method where electrodes are formed directly on the thermoelectric element surfaces, thereby eliminating unnecessary components that increase thickness
Solution Approach 2:
The patent combines the electrode formation and element bonding processes into a single integrated step, where electrodes are directly deposited onto the thermoelectric elements, merging previously separate functions into one unified structure that reduces overall module thickness
2Reliability
If chips are mounted one by one on electrode substrates using solder materials, then reliable bonding is achieved, but productivity and manufacturing efficiency decrease
Solution Approach 1:
The patent merges multiple individual chip mounting operations into a single batch processing step, where multiple thermoelectric elements are simultaneously bonded to electrodes in one process, dramatically improving manufacturing efficiency while maintaining bonding reliability
Solution Approach 2:
The patent performs preliminary preparation of thermoelectric element chips with standardized surfaces that enable direct bonding, allowing subsequent mass production through automated processes rather than manual one-by-one mounting
3Stability of the object's composition
If traditional manufacturing methods with supports and solder materials are used, then assembly stability is maintained, but material usage and module weight increase
Solution Approach 1:
The patent extracts and eliminates support structures and solder materials from the assembly, retaining only the essential thermoelectric elements and electrodes directly bonded together, thereby reducing material usage while maintaining structural stability through optimized direct bonding
Solution Approach 2:
The patent applies localized bonding interfaces with enhanced adhesion properties at the electrode-element contact points, concentrating bonding strength where needed rather than using extensive solder materials throughout the assembly, thus maintaining stability with reduced material usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient production of thin thermoelectric conversion modules without the need for supports and solder materials, enhancing productivity and reliability while reducing material usage.
Implementation Method 1
filling an insulator between the chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material
Implementation Method 2
a pair of electrodes spaced apart from each other are provided on a substrate, for example, a lower surface of a P-type thermoelectric element is provided on one electrode and a lower surface of an N-type thermoelectric element is provided on the other electrode
Implementation Method 3
a device that directly inter-converts thermal energy and electrical energy using a thermoelectric conversion module having a thermoelectric effect such as a Seebeck effect or a Peltier effect
Data Source
AI summary
Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).