Thin Vapor-Chamber Heat Dissipation Under Normal Pressure
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Solution Overview
Problem
The increasing heat flow density in compact electronic devices, such as AI and 5G computing devices, poses challenges for heat dissipation, particularly in small, thin structures where traditional thermal convection methods are impractical, and the use of graphene-based heat sinks is costly and complicates manufacturing due to the need for negative pressure.
Innovation Solution
A dissipating device utilizing a working fluid that undergoes phase transition to absorb and dissipate heat energy, operating under normal pressure, with a sealed structure composed of thermally conductive materials and a working fluid mixture that circulates between temperature regions to facilitate efficient heat transfer without the need for negative pressure manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If thermal convection is used with a cooling fan, then heat dissipation efficiency is improved, but device size and thickness increase making it unsuitable for compact electronic products
Solution Approach 1:
The patent employs phase transition of working fluid (liquid to vapor and back) as the core heat dissipation mechanism. The working fluid absorbs heat during evaporation at the heat source interface and releases heat during condensation in the heat dissipation region, enabling efficient heat transfer without requiring large mechanical components like cooling fans.
Solution Approach 2:
The patent uses a closed-loop liquid-vapor cycle system where working fluid circulates through phase changes. The fluid is injected into a cavity, evaporates upon contact with the heat source, rises due to vapor density differences, condenses on the heat dissipation surface, and returns to repeat the cycle, creating a self-sustaining thermal management system.
2Loss of energy
If graphene is used as heat sink material, then heat dissipation performance is improved, but manufacturing complexity and cost increase due to negative pressure requirements
Solution Approach 1:
The patent utilizes phase transition of working fluid to transfer heat from the heat source through the cavity to the heat dissipation surface. This approach replaces expensive graphene materials with a simpler liquid-vapor cycle system that achieves comparable or superior heat dissipation without requiring negative pressure manufacturing processes.
Solution Approach 2:
The patent changes the working pressure parameter from negative pressure (required for graphene heat sinks) to normal pressure operation. The working fluid cycle operates effectively at atmospheric pressure, eliminating the need for complex vacuum sealing and negative pressure maintenance infrastructure during manufacturing and operation.
3Loss of energy
If working fluid heat dissipation is used under negative pressure, then heat dissipation efficiency is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent fundamentally changes the operating pressure parameter from negative pressure to normal pressure. This allows the working fluid to be injected and sealed under standard atmospheric conditions, eliminating the need for vacuum chambers, pressure control systems, and specialized sealing procedures required for negative pressure operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation in thin electronic devices with a lightweight, compact design, simplifying the manufacturing process and reducing costs by allowing the device to be manufactured under normal pressure, while maintaining high heat dissipation efficiency.
Implementation Method 1
the working fluid is heated and undergoes a phase transition from liquid to vapor and circulates inside the heat-dissipating device
Implementation Method 2
the working fluid is transformed to the vapor state, and then is condensed back to the liquid state
Implementation Method 3
the working fluid circulates inside the heat-dissipating device, the heat-dissipating device will form a first temperature region and a second temperature region
Implementation Method 4
a dissipating device comprising a first sheet body and a second sheet body, wherein a sealed working space is formed between the first sheet body and the second sheet body; a working fluid is stored in the working space
Data Source
AI summary
A dissipating device configured to dissipate the heat energy generated by the heat sources in the electronic devices. When the dissipating device contacts the heat sources, the heat energy can be absorbed by the dissipating device. The working fluid is stored within the dissipating device such that the working fluid can undergo a phase transition after the dissipating device absorbs heat energy. Then the working fluid can circulate inside the dissipating device. Accordingly, the heat-dissipation mechanism, which is applied to the dissipating device contacting the electronic devices, can be effectively sped up. The dissipating device is formed into a thin structure to achieve an excellent heat-dissipation effect with a limited heat-dissipation area.