Conductive Thin Wire Plating for Low-Visibility Conductive Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conductive substrates with conductive thin wires face challenges in achieving both low electric resistance and being difficult to see, as existing methods struggle to balance conductivity and visibility.
Innovation Solution
A manufacturing method involving forming a thin wire on a substrate, treating it with an organic acid solution, followed by plating, and using specific pH and quaternary ammonium salts to create a conductive thin wire with a metal content optimized for low electric resistance and reduced visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive thin wire containing metallic silver is formed using conventional plating methods, then the electric resistance is reduced, but the visibility of the wire increases
Solution Approach 1:
The patent applies parameter changes by controlling the pH value of the plating solution within a specific range (2.0-4.0) and adjusting the thickness of the conductive thin wire (0.5-5.0 μm). These parameter optimizations enable the wire to achieve low electric resistance while maintaining reduced visibility, resolving the contradiction between conductivity and visibility.
Solution Approach 2:
The patent uses composite materials by combining metallic silver with a polymer material in the conductive thin wire. This composite structure allows the wire to achieve both electrical conductivity through the metal particles and reduced visibility through the polymer matrix, simultaneously addressing both requirements.
2Reliability
If the thickness of the conductive thin wire is increased to reduce electric resistance, then the conductivity improves, but the visibility and bendability deteriorate
Solution Approach 1:
The patent optimizes the thickness parameter of the conductive thin wire within the range of 0.5-5.0 μm. This precise parameter control ensures that the wire achieves sufficient electrical conductivity while maintaining adequate bendability and flexibility, preventing the wire from becoming too thick and rigid.
Solution Approach 2:
By forming a composite structure where metal particles are dispersed in a polymer matrix, the patent achieves a balance between conductivity and flexibility. The polymer component provides flexibility and bendability, while the metal particles provide electrical conductivity, allowing the wire to meet both requirements simultaneously.
3Ease of manufacture
If enzyme-containing treatment liquid is used to treat the silver halide emulsion layer, then the conductive material can be formed, but the binder is degraded and manufacturing complexity increases
Solution Approach 1:
The patent extracts and removes the binder component from the silver halide emulsion layer through treatment with a specific solution before plating. This extraction step simplifies the subsequent plating process by eliminating the need for enzyme-containing treatment liquids, thereby reducing manufacturing process complexity while still enabling conductive material formation.
Solution Approach 2:
The patent performs a preliminary treatment step using a non-enzyme solution to remove the binder before the plating process. This preliminary action prepares the substrate for plating by eliminating the binder that would otherwise interfere with the plating process, avoiding the need for complex enzyme-based treatments later in the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a conductive substrate with a conductive thin wire that has a small electric resistance and is difficult to see, ensuring both conductivity and visibility are balanced, with a metal content optimized for reduced visibility and improved bendability.
Implementation Method 1
a step 2 of bringing the thin wire into contact with a solution containing an organic acid
Implementation Method 2
a step 3 of subjecting the thin wire to a plating treatment to form a conductive thin wire
Data Source
AI summary
A manufacturing method for a conductive substrate, with which a conductive substrate including a substrate and a conductive thin wire arranged on the substrate are manufactured, includes in the following order, a step 1 of forming a thin wire containing a metal on the substrate; a step 2 of bringing the thin wire into contact with a solution containing an organic acid; and a step 3 of subjecting the thin wire to a plating treatment to form a conductive thin wire.