Thinned Display Substrate with Organic Insulating Layer
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Solution Overview
Problem
Existing display devices face challenges in thinning while maintaining mechanical strength and preventing damage, especially when the substrate thickness reaches 0.3 mm or less, as they become brittle and prone to damage during handling, and existing methods do not adequately address internal stress issues.
Innovation Solution
The use of organic insulating layers between the substrates and transistors, combined with inorganic insulating layers as reinforcing and stress adjustment layers, to enhance the mechanical strength and control internal stress, allowing for further thinning to 0.15 mm or less without compromising reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate thickness is reduced to thin the display device, then the display device thickness is reduced, but the mechanical strength decreases and the substrate becomes brittle and prone to damage
Solution Approach 1:
The patent applies composite materials by combining the glass substrate with organic insulating layers (such as polyimide or acrylic resins) to create a composite structure. This composite construction allows the glass substrate to be thinned to 0.3mm or less while the organic layers provide reinforcement, preventing brittleness and damage during handling. The composite structure achieves both thinness and mechanical strength simultaneously.
2Length of moving object
If the substrate thickness is reduced to thin the display device, then the display device thickness is reduced, but the substrate becomes prone to warping due to internal stress
Solution Approach 1:
The patent applies parameter changes by carefully controlling the thickness parameters of both the glass substrate (0.3mm or less) and the organic insulating layers. By optimizing these thickness parameters, the internal stress distribution is balanced, preventing warping while maintaining thinness. The specific thickness ratios and values are tuned to achieve stress neutrality in the composite structure.
Solution Approach 2:
The composite structure of glass substrate and organic insulating layers allows for stress management. The organic layers have different thermal expansion coefficients and mechanical properties compared to glass, and by selecting appropriate materials and thicknesses, the overall composite structure achieves dimensional stability and resistance to warping despite the reduced substrate thickness.
3Length of moving object
If mechanical polishing or chemical polishing is used to thin the element substrate, then the substrate thickness is reduced, but the manufacturing complexity and risk of damage increase
Solution Approach 1:
The patent applies preliminary action by forming the organic insulating layers on the substrate surface before the thinning process. This pre-coating provides protection during subsequent polishing operations, reducing the risk of damage to the thin substrate. The organic layers act as a protective buffer that allows mechanical or chemical polishing to proceed with less risk, simplifying the manufacturing process while achieving the desired thin thickness.
Data Source
AI summary
A display device in an embodiment according to the present invention includes a first substrate, a second substrate opposing the first substrate, and a transistor provided in the first substrate, a scanning signal line, a video signal line, and a pixel electrode that are electrically connected to the transistor, and a first insulating layer. The thickness of the first substrate is 0.3 mm or less, the first insulating layer contacts the first substrate, and is provided between the first substrate and the transistor, and the first insulating layer includes an organic insulating layer.