Thinned Electronic Product Manufacturing via Stamping
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Solution Overview
Problem
The manufacturing process of thinned electronic products faces challenges with positioning and yield loss due to high pressure and temperature in in-mold injection molding, and the use of polymer films is costly and complex.
Innovation Solution
A method where a conductive circuit is directly formed on a supporting body without an intervening polymer film, using hot or cold stamping processes to create a conductive circuit, followed by the placement of an electronic element and a film layer, simplifying the process and reducing material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If in-mold injection molding technology is used to form the conductive circuit on the supporting structure, then the conductive circuit can be formed directly on the supporting structure, but high pressure and high temperature during the process cause high yield loss
Solution Approach 1:
The patent changes the forming method from in-mold injection molding (high pressure and temperature) to hot stamping or cold stamping processes. The hot stamping process uses controlled heat and pressure to transfer the conductive circuit pattern, while cold stamping uses room temperature pressing with adhesive layers, thereby avoiding the excessive pressure and temperature that cause yield loss.
Solution Approach 2:
The patent replaces the in-mold injection molding mechanical system with stamping processes. Instead of injecting molten material under high pressure into a mold, the patent uses stamping dies to directly press and transfer the conductive circuit pattern onto the supporting structure, substituting a different mechanical approach that is gentler on the materials.
2Ease of manufacture
If conductive ink is printed on a polymer film to form a conductive circuit, then the conductive circuit can be formed, but positioning and adhering problems occur during bonding
Solution Approach 1:
The patent merges the conductive circuit formation with the supporting structure itself. Instead of forming the circuit on a separate polymer film and then bonding it to the supporting structure (which causes positioning and adhering problems), the circuit is directly formed on the supporting structure, eliminating the intermediate bonding step and its associated precision issues.
Solution Approach 2:
The patent extracts and eliminates the polymer film intermediate layer from the manufacturing process. By removing this intermediate layer, the patent eliminates the positioning and adhering problems that occur when bonding the film to the supporting structure, while still achieving the desired conductive circuit functionality.
3Ease of manufacture
If an intervening polymer film is used to form the conductive circuit, then the circuit can be formed and bonded, but material cost increases and process complexity increases
Solution Approach 1:
The patent extracts and removes the polymer film from the manufacturing process entirely. By eliminating this intermediate material layer, the patent simplifies the overall process structure, reduces material costs, and decreases process complexity while maintaining the essential functionality of forming and bonding the conductive circuit to the supporting structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces material costs, and minimizes yield loss by eliminating the need for polymer films, while ensuring effective electrical connectivity and structural integrity of the thinned electronic product.
Implementation Method 1
a conductive circuit is formed on a first surface of a supporting body
Implementation Method 2
a film layer is disposed on the conductive circuit having the electronic element, wherein the electronic element and the conductive circuit are wrapped between the supporting body and the film layer
Data Source
AI summary
A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.