Thinned Heat Dissipation Middle Member With Channeled Structures
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Solution Overview
Problem
Conventional heat dissipation devices, such as heat pipes and vapor chambers, face challenges when thinned for narrow spaces, including structural weakness, deformation, and difficulties in maintaining effective capillary structures, which impede vapor-liquid circulation and heat transfer.
Innovation Solution
A middle member with a thin capillary structure featuring multiple perforations and a channeled structure, arranged in alignment or not, integrated into a single plate body, enhances capillary attraction and supports vapor-liquid circulation within a closed chamber, preventing deformation and maintaining efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the heat pipe and vapor chamber are thinned to adapt to narrow spaces, then the device can be applied to compact devices like mobile phones and intelligent watches, but the structural strength decreases and deformation occurs
Solution Approach 1:
The patent uses copper as the base material for the heat dissipation device, which provides both excellent thermal conductivity and sufficient structural strength even when thinned. The copper material allows the device to maintain integrity in narrow spaces while achieving the required thin profile for compact applications.
2Volume of moving object
If the heat pipe and vapor chamber are thinned, then the device fits narrow spaces, but the vacuumed chamber space is narrowed and capillary structure performance deteriorates
Solution Approach 1:
The patent employs sintered powder as the capillary structure within the vacuumed chamber. The porous sintered material provides effective capillary action for liquid working fluid circulation even in the narrowed space of the thinned device, ensuring reliable heat transfer performance despite the reduced chamber volume.
3Ease of manufacture
If conventional capillary structures like sintered powder or woven mesh body are used in narrow spaces, then the device can be manufactured, but the vapor-liquid circulation is interrupted and heat transfer efficiency decreases
Solution Approach 1:
The patent optimizes the capillary structure by using sintered powder with specific pore size distribution and density tailored for the narrow vacuumed chamber. The local properties of the sintered material are adjusted to ensure effective capillary action and vapor-liquid circulation within the constrained space, maintaining high heat transfer efficiency despite manufacturing constraints.
4Volume of moving object
If the copper plate is thinned, then the device can be made compact, but the copper plate deforms and the vacuumed chamber is compressed or collapsed
Solution Approach 1:
The patent controls the thickness and physical parameters of the copper plate within specific ranges to balance flexibility and structural stability. By optimizing the copper plate thickness parameter, the device achieves compact dimensions while preventing deformation and maintaining the integrity of the vacuumed chamber during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures effective vapor-liquid circulation and heat dissipation in narrow spaces, preventing deformation and enhancing the structural integrity of the heat dissipation device, thereby maintaining efficient heat transfer and preventing overheating or burnout.
Implementation Method 1
Complex surface structures are disposed on one of the first and second faces or both the first and second faces of the middle member main body to enhance the capillary attraction
Implementation Method 2
When heated, the liquid working fluid in the vacuumed chamber is evaporated into vapor
Implementation Method 3
The vapor working fluid is then condensed into liquid working fluid
Implementation Method 4
transfer and dissipate heat by way of vapor-liquid circulation, such as heat pipe and vapor chamber
Data Source
AI summary
A middle member of heat dissipation device and the heat dissipation device. The middle member includes a middle member main body having a first face, a second face, multiple perforations and a channeled structure assembly. The channeled structure assembly is disposed on the first face or the second face. The perforations are formed through the middle member main body between the first and second faces. The channeled structure assembly and the perforations are arranged in alignment with each other or not in alignment with each other. The middle member and a first plate body and a second plate body are overlapped with each other to form the heat dissipation device. The complex structures disposed on the first and second faces of the middle member main body are able to achieve a stable vapor-liquid circulation effect.