Multidie Support Layers for Thinned Die Warpage Reduction
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Solution Overview
Problem
Semiconductor packages face challenges in reducing warpage of thinned semiconductor die, which can prevent successful processing and packaging due to tensile forces and stress-induced bending, especially when die size exceeds thickness, leading to issues in die bonding, encapsulating, and other packaging operations.
Innovation Solution
Implementing a die support structure, either permanent or temporary, made of materials like mold compounds that can be coupled to the planar surfaces and thickness of semiconductor die, reducing warpage to less than 200 microns through techniques such as light exposure, ultrasonic energy, peeling, etching, or grinding, and using multiple layers to stabilize the die during packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor die are thinned to reduce size, then device miniaturization is achieved, but warpage increases making processing and packaging difficult
Solution Approach 1:
The patent introduces a die support structure that segments the thinned semiconductor die into supported and unsupported regions. The support structure comprises a support layer coupled to the back surface of the die, creating discrete support zones that prevent warpage without requiring support across the entire die surface, thus maintaining miniaturization while controlling deformation.
Solution Approach 2:
The patent employs composite material structures where the die support structure includes a support layer with different mechanical properties than the semiconductor die. This composite construction combines the thin, miniaturized die with a support material that has appropriate stiffness and adhesion characteristics to counteract warpage forces while maintaining the overall small form factor.
2Volume of moving object
If die size exceeds thickness, then miniaturization is achieved, but tensile forces and stress-induced bending increase
Solution Approach 1:
The patent applies the preliminary action principle by pre-coupling the support layer to the back surface of the thinned die before packaging operations. This preliminary support structure is already in place to counteract tensile forces and stress-induced bending that will occur during subsequent processing, preventing deformation before it happens rather than correcting it afterward.
Solution Approach 2:
The patent changes the mechanical parameters of the die system by introducing a support layer with specific thickness, stiffness, and adhesion properties. This parameter modification increases the overall structural strength and resistance to tensile forces and bending, allowing the die to maintain its thin, miniaturized form while gaining the necessary mechanical robustness.
3Manufacturing precision
If permanent die support structure is used, then warpage is reduced, but removal and reconfiguration becomes difficult
Solution Approach 1:
The patent treats the die support structure as a temporary, disposable element that serves its purpose during critical packaging operations and is then removed. The support layer is designed to be easily removable through methods such as etching, peeling, or ultrasonic treatment, allowing the die to be reconfigured or repurposed after the support is no longer needed, much like a disposable tool that serves a specific function and is then discarded.
4Ease of repair
If temporary die support structure is used, then ease of removal is improved, but warpage control may be insufficient
Solution Approach 1:
The patent optimizes the parameters of the temporary support structure, including the thickness, material composition, and coupling strength of the support layer. These parameter adjustments ensure that the support provides sufficient warpage control during packaging while maintaining ease of removal through controlled etching, peeling, or ultrasonic treatment, balancing both requirements through precise parameter selection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The die support structures effectively reduce warpage to desired thresholds, enabling successful processing and packaging operations by stabilizing the semiconductor die under various forces, ensuring proper formation of semiconductor packages.
Implementation Method 1
The die support structures effectively reduce warpage to desired thresholds, enabling successful processing and packaging operations by stabilizing the semiconductor die under various forces
Implementation Method 2
The material may be configured to be removable by one of exposure to light, ultrasonic energy, peeling, etching, grinding, or any combination thereof
Data Source
AI summary
Implementations of a semiconductor device may include a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and one of a permanent die support structure, a temporary die support structure, or any combination thereof coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof. The first largest planar surface, the second largest planar surface, and the thickness may be formed by at least two semiconductor die. The warpage of one of the first largest planar surface or the second largest planar surface may be less than 200 microns.