Thinned Substrate Perimeter Trench Sensor Array Package
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Solution Overview
Problem
Traditional mounting approaches for thinned-substrate devices are inefficient, consuming valuable space and failing to effectively couple electrical power and signals, thereby negating the size advantages of thinned devices.
Innovation Solution
The implementation of a thinned substrate device with perimeter edge trenches and bond pads, bonded to a core layer with resin layers that support conductive traces for efficient electrical coupling, allowing for a low-profile and space-efficient mounting solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional mounting approaches are used for thinned-substrate devices, then electrical power and signals can be coupled to the device, but the mounting structure consumes relatively large volume and loses the size advantages of thinned devices
Solution Approach 1:
The patent transitions from planar electrical connections to three-dimensional vertical connections by forming conductive vias through the substrate thickness. This allows electrical signals to be coupled vertically through the thinned substrate to underlying mounting structures, eliminating the need for lateral connection extensions and reducing overall mounting volume while maintaining reliable electrical coupling.
Solution Approach 2:
The patent embeds the thinned substrate within a multi-layer mounting structure where conductive traces are formed within the substrate and connected to external contacts through vias. The substrate is nested between upper and lower mounting layers, with electrical connections passing through the substrate thickness, creating a compact nested configuration that minimizes volume while preserving electrical functionality.
2Length of moving object
If thinned substrate devices are used to reduce device thickness, then size advantages are achieved, but traditional mounting approaches add undue thickness and negate these advantages
Solution Approach 1:
The thinned substrate itself is configured to provide the electrical connection function through integrated conductive traces and vias formed within its thickness. Rather than requiring separate external mounting structures to provide connections, the substrate serves its own electrical coupling needs through internally formed conductive paths that extend through its reduced thickness to contact pads on the mounting structure.
Solution Approach 2:
The patent utilizes the vertical dimension through the substrate thickness to establish electrical connections via conductive vias, rather than requiring lateral extensions that would increase mounting footprint. This vertical connection approach allows the thinned substrate to maintain its thickness advantage while achieving reliable electrical coupling through the reduced thickness to the mounting structure.
3Reliability
If thinned substrate devices are mounted using traditional approaches, then electrical connections can be established, but the mounting process consumes valuable space and adds complexity
Solution Approach 1:
The patent merges the electrical connection function with the substrate structure itself by forming conductive traces and vias directly within the thinned substrate. This integration eliminates the need for separate external connection structures, reducing mounting complexity while maintaining reliable electrical connections. The substrate simultaneously serves as both the device carrier and the electrical interconnection medium.
Data Source
AI summary
One embodiment of a perimeter trench sensor array package can include a thinned substrate device that includes a perimeter trench formed near the edges of the device that can be configured to be thinner than a central portion of the thinned substrate device. The perimeter trench can include bond pads that can couple to electrical elements included in the thinned substrate device. The thinned substrate device can be attached to a core layer that can in turn support one or more resin layers. The core layer and the resin layers can form a printed circuit board assembly, a flex cable assembly or a stand-alone module.