Thinned Wafer Support Structures for Carrier-Free Packaging
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Solution Overview
Problem
Current semiconductor package fabrication processes face challenges in minimizing package size and providing adequate support for thinned semiconductor substrates without using carriers, which can lead to handling and packaging difficulties.
Innovation Solution
The implementation of a support structure, potentially including organic compounds like polymers or mold compounds, is coupled to the semiconductor wafer at various locations, such as the edge or perimeter, forming shapes like wheel and spoke, strips, or intersecting structures to provide necessary support and stability during processing and packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thinned semiconductor substrate is used to minimize package size, then the package size is reduced, but the substrate becomes more fragile and difficult to handle
Solution Approach 1:
The support structure is divided into multiple discrete elements (struts, ribs, or localized regions) rather than a continuous carrier. These segmented support elements are strategically positioned at specific locations on the thinned substrate to provide strength where needed while maintaining overall substrate thinness and minimizing package size.
Solution Approach 2:
The substrate thickness and support structure are varied locally rather than uniformly. The substrate is thinned in active device regions while maintaining greater thickness in peripheral regions, and support structures are concentrated at specific locations (edges, corners, or between devices) where mechanical support is most needed, creating local quality variations that optimize both strength and size.
2Strength
If a carrier is used to support the thinned substrate, then the substrate strength is improved, but the package size increases and handling complexity increases
Solution Approach 1:
The traditional continuous carrier is extracted and replaced with minimal discrete support elements. Only the essential support function is retained through strategically placed struts or ribs, while the unnecessary carrier material and complexity are removed. This extraction approach provides adequate substrate support without the bulk and handling complexity of full carriers.
Solution Approach 2:
The support structures are designed as temporary, minimal elements that serve their support function during critical processing steps and can be removed or degraded without affecting the final device. These simple support elements are easier and cheaper to remove than traditional carriers, reducing overall process complexity.
3Volume of moving object
If the substrate is thinned to minimize package volume, then the package volume is reduced, but the substrate becomes more susceptible to damage during processing
Solution Approach 1:
Support structures are applied or formed on the thinned substrate before critical processing steps occur. This preliminary support is in place during subsequent processing operations, preventing damage before it can occur. The support elements are positioned in advance to protect vulnerable areas during handling and processing.
Solution Approach 2:
The support structures act as a cushioning layer between the thinned substrate and potential damage sources during processing. These structures absorb mechanical stresses and prevent direct contact between the fragile thinned regions and handling tools or processing equipment, providing beforehand protection against processing damage.
Data Source
AI summary
Implementations of a semiconductor substrate may include a wafer including a first side and a second side; and a support structure coupled to the wafer at a desired location on the first side, the second side, or both the first side and the second side. The support structure may include an organic compound.