Thinner Composition for Edge Bead Removal

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Solution Overview

Problem

Current photolithography processes face challenges in efficiently removing irregular photoresist material from semiconductor substrates, leading to edge bead formation and reduced coating properties, which affect the accuracy and productivity of semiconductor device manufacturing.

Innovation Solution

A thinner composition comprising an acetate-based compound, a lactate-based compound, and an ether-based additive, with specific weight percent and ppm ranges, is used for pre-wetting and edge bead removal, improving solubility and volatility to enhance the Removing Resist Coating (RRC) and Edge Bead Removal (EBR) properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional thinner compositions are used for edge bead removal, then the photoresist material can be removed, but irregular portions remain and coating properties deteriorate

Engineering Contradiction:
Improveedge bead removal qualityVSAvoidcoating properties
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent modifies the chemical composition parameters of the thinner by incorporating specific ratios of acetate-based compounds (30-70 wt%), lactate-based compounds (1-20 wt%), and propionate-based compounds (30-60 wt%). This parameter optimization enables the thinner to effectively dissolve irregular photoresist portions while maintaining proper coating properties, resolving the contradiction between removal quality and coating performance.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the thinner composition has high solubility to remove irregular photoresist, then edge bead removal is improved, but particle aggregation occurs

Engineering Contradiction:
Improveedge bead removal efficiencyVSAvoidparticle aggregation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent creates a composite thinner composition by combining multiple ester-based compounds (acetate, lactate, propionate) with complementary solubility characteristics. This composite approach provides high solubility for effective edge bead removal while the diverse molecular structures prevent particle aggregation, simultaneously achieving both removal efficiency and particle control.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The different ester-based compounds in the thinner composition provide localized functions: acetate-based compounds target photoresist dissolution at edge portions, while lactate and propionate compounds provide solubility control and prevent aggregation in different regions of the coating process, achieving both removal efficiency and particle prevention through spatially differentiated chemical actions.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If the thinner composition is optimized for RRC property, then photoresist removal is improved, but volatility control becomes difficult

Engineering Contradiction:
Improveresist coating removal propertyVSAvoidvolatility
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The patent optimizes the molecular weight and chemical structure parameters of the ester-based compounds to achieve the desired balance. The selected compounds have molecular weights and structures that provide high RRC performance through effective photoresist dissolution while maintaining controlled volatility for stable processing temperatures, resolving the contradiction between removal performance and volatility control.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition effectively reduces surface tension, prevents particle aggregation, and optimizes coating properties, leading to improved RRC and EBR performance, thereby enhancing the precision and efficiency of semiconductor device manufacturing.

Implementation Method 1

The composition effectively reduces surface tension

Methodology Applied
Scientific EffectSurface tension reduction: Surfactant

Implementation Method 2

prevents particle aggregation

Methodology Applied
Scientific EffectParticle aggregation prevention: Dispersion (of waves)

Implementation Method 3

improving solubility to enhance the Removing Resist Coating (RRC) and Edge Bead Removal (EBR) properties

Methodology Applied
Scientific EffectSolubility: Solvation

Implementation Method 4

improving solubility and volatility to enhance the Removing Resist Coating (RRC) and Edge Bead Removal (EBR) properties

Methodology Applied
Scientific EffectVolatility: Evaporation

Data Source

PatentUS9885955B2Thinner compositions
Publication Date: 2018.02.06 SAMSUNG ELECTRONICS CO LTD
  • US9885955B2 patent drawing
  • US9885955B2 patent drawing
  • US9885955B2 patent drawing

AI summary

A thinner composition including an acetate-based compound in an amount in a range of about 30 weight percent to about 70 weight percent, a lactate-based compound in an amount in a range of about 1 weight percent to about 20 weight percent, a propionate-based compound in an amount in a range of about 30 weight percent to about 60 weight percent, and an ether-based additive in an amount in a range of about 10 ppm to about 500 ppm, based on a total amount of the composition.