Thioether-Organic Composite for Copper Nanoparticle Dispersion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Copper nanoparticles are challenging to produce with stable dispersion and low-temperature sinterability due to susceptibility to oxidation and difficulty in controlling particle size, limiting their practical application in conductive materials.
Innovation Solution
A composite of thioether-containing organic compounds and copper nanoparticles or copper(I) oxide nanoparticles is developed, where the organic compound acts as a protective agent, enabling stable dispersion and low-temperature sinterability by forming a stable film with metallic luster and high conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If copper nanoparticles are produced using conventional methods, then copper particles can be synthesized, but particle size control and dispersion stability are difficult to achieve
Solution Approach 1:
The patent introduces a thioether-containing organic compound as an intermediary substance that mediates between copper ions and the final nanoparticle structure. This compound acts as a protective agent during synthesis and a dispersant in the final product, enabling both precise particle size control and stable dispersion by coordinating with copper surfaces and preventing aggregation.
Solution Approach 2:
The patent employs parameter changes by adjusting the molecular structure of the thioether-containing organic compound (varying chain length, branching, and functional groups) to optimize both particle size control and dispersion stability. By changing parameters such as the hydrophobic/hydrophilic balance and molecular weight of the protective agent, the patent achieves simultaneous improvement in manufacturing precision and reliability.
2Ease of manufacture
If copper nanoparticles are used as conductive materials, then low cost is achieved, but oxidation susceptibility limits practical application
Solution Approach 1:
The patent creates an inert environment by forming a protective organic compound coating around copper nanoparticles. This hydrophobic organic layer acts as a barrier that prevents oxygen access to the copper surface, effectively creating an inert microenvironment that protects against oxidation while maintaining the low cost advantage of copper materials.
Solution Approach 2:
The patent transforms pure copper nanoparticles into composite structures consisting of copper core and thioether-containing organic compound shell. This composite material approach combines the electrical conductivity and low cost of copper with the oxidation resistance and dispersibility of the organic compound, enabling practical applications.
3Productivity
If conventional copper particle synthesis is used, then copper particles can be produced, but low-temperature sinterability is not achieved
Solution Approach 1:
The patent extracts the organic compound protective agent from the synthesis process and uses it as a separate functional component that enables low-temperature sintering. By removing the need for high-temperature processing typically required for particle consolidation, the patent achieves both fine particle size control and low-temperature sinterability, improving productivity while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite ensures stable dispersion of copper nanoparticles for months and allows for the formation of conductive films with resistivity of 10−5 to 10−6 Ωcm, suitable for circuit patterns and thermal conductors, with copper(I) oxide nanoparticles also applicable for semiconductor films.
Implementation Method 1
a thioether-containing organic compound having a specific structure and copper nanoparticles or copper(I) oxide nanoparticles... in which a thioether-containing organic compound is used as a copper-colloid protective agent
Implementation Method 2
stable dispersion of copper nanoparticles or copper(I) oxide nanoparticles in a medium
Implementation Method 3
a copper compound is reduced in the presence of the copper-colloid protective agent
Implementation Method 4
good electrical wiring can be formed by only drawing a circuit by a printing process and then sintering the circuit at a low temperature
Data Source
AI summary
Provided is a composite including copper nanoparticles or copper(I) oxide nanoparticles and a thioether-containing organic compound represented by X(OCH2CHR1)nOCH2CH(OH)CH2SZ [X represents an alkyl group; R1 represents a hydrogen atom or a methyl group; n represents an integer of 2 to 100; R1 is independent between repeating units and may be the same or different; and Z represents an alkyl group, an allyl group, an aryl group, an arylalkyl group, —R2—OH, —R2—NHR3, or —R2—(COR4)m (where R2 represents a saturated hydrocarbon group; R3 represents a hydrogen atom, an acyl group, an alkoxycarbonyl group, or a benzyloxycarbonyl group; R4 represents a hydroxy group, an alkyl group, or an alkoxy group; and m represents 1 to 3)]. Provided is a method for producing a composite of an organic compound and copper nanoparticles or a composite of an organic compound and copper(I) oxide nanoparticles, the method including reducing a copper compound in the presence of a thioether-containing organic compound represented by the general formula (1) above.