Thiol Adhesion Layer for Superconducting Resonator Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing metal fluoride encapsulation methods for superconducting devices in quantum processors are inadequate in preventing RF absorption and oxide regrowth, leading to reduced wavefunction lifetime due to strong absorption by oxide layers and incomplete coverage of the metal fluoride layer.
Innovation Solution
An adhesion layer comprising thiol-based chemical compounds is deposited on oxide-free surfaces of superconducting resonators and substrates within quantum processors, enhancing the adhesion and uniformity of metal fluoride coatings, thereby inhibiting oxide regrowth and RF absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal fluoride layer is deposited to encapsulate superconducting devices, then RF absorption is reduced and oxide regrowth is inhibited, but the layer forms islands that leave parts of the quantum processor exposed
Solution Approach 1:
A thiol-based adhesion layer is introduced as an intermediary between the substrate/superconducting resonator and the metal fluoride encapsulation layer. This adhesion layer promotes uniform nucleation and continuous coverage of the metal fluoride layer, preventing island formation while maintaining the encapsulation's effectiveness in reducing RF absorption and inhibiting oxide regrowth.
2Object-affected harmful factors
If oxide layers are removed via etching treatment, then RF absorption is reduced, but oxide regrowth occurs rapidly in ambient atmosphere
Solution Approach 1:
The thiol-based adhesion layer is deposited in advance to create a protective surface that prevents oxide regrowth. This preliminary action establishes a barrier that maintains the oxide-free state for an extended period, allowing subsequent encapsulation steps to proceed without rapid oxide formation that would increase RF absorption.
Solution Approach 2:
The thiol-based adhesion layer serves as a protective intermediary between the oxide-free superconducting surfaces and the ambient atmosphere. This adhesion layer acts as a barrier that prevents oxygen exposure and subsequent oxide regrowth, while also providing a suitable surface for uniform metal fluoride encapsulation.
3Device complexity
If metal fluoride layer thickness is reduced, then fabrication complexity is decreased, but the layer forms islands that leave quantum processor exposed
Solution Approach 1:
The thiol-based adhesion layer enables thin metal fluoride layers to form continuous, uniform coverage rather than islands. By improving interfacial adhesion and nucleation, the adhesion layer allows the encapsulation to be effective at reduced thicknesses, simplifying fabrication while maintaining encapsulation completeness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesion layer significantly improves the adhesion and uniformity of metal fluoride coatings, reducing RF absorption by up to 1,000 times that of oxide layers and extending the wavefunction lifetime of quantum processors.
Implementation Method 1
An adhesion layer comprising one or more thiol-based chemical compounds... enhance the adhesive properties of the quantum processor surface with regards to a metal fluoride coating
Implementation Method 2
decrease RF absorption... inhibition of one or more oxide layers within the quantum processor
Data Source
AI summary
Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing an adhesion layer onto a superconducting resonator and a silicon substrate that are comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the adhesion layer can comprise a chemical compound having a thiol functional group.