Polyfunctional Thiol Composition for Tack-Free Epoxy Curing
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Solution Overview
Problem
Existing thiol compounds used as curing agents for epoxy resins cause adhesion to fingers during curing, affecting the surface state of the cured product, and there is a demand for a compound that provides high elongation, low elasticity, and tack-free performance.
Innovation Solution
A polyfunctional thiol compound with a specific thiol group structure, represented by general formula (I), is used as a curing agent for epoxy resins, enabling rapid curing and producing a tack-free cured product with high elongation and low elasticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bifunctional thiol compound with a long molecular chain is used as a curing agent for epoxy resins, then the cured product achieves high elongation and low elasticity with excellent impact resistance, but the surface of the cured product becomes tacky and adheres to fingers during curing
Solution Approach 1:
The patent changes the molecular structure parameters of the thiol compound by introducing a specific polyfunctional core structure (pentaerythritol, dipentaerythritol, or trimethylolpropane) with multiple thiol groups. This structural parameter change enables the compound to achieve both high elongation/low elasticity and tack-free surface properties simultaneously, resolving the contradiction between impact resistance and adhesion.
Solution Approach 2:
The patent uses composite curing agents that combine multiple thiol groups within a single molecular structure (polyfunctional thiol compounds). These composite molecules integrate the beneficial properties of long molecular chains (for elongation and impact resistance) while the specific polyfunctional core structure prevents surface adhesion, achieving both requirements simultaneously.
2Object-generated harmful factors
If a polyfunctional thiol compound with a specific structure is used to achieve tack-free performance, then the cured product surface remains non-adhesive, but the compound must be designed to maintain high elongation and low elasticity
Solution Approach 1:
The patent employs polyfunctional thiol compounds that perform multiple functions simultaneously: the polyfunctional core structure (pentaerythritol, dipentaerythritol, or trimethylolpropane) provides both the tack-free surface property and the high elongation/low elasticity characteristic. This multi-functionality reduces the need for complex molecular designs while achieving both requirements.
Solution Approach 2:
The patent optimizes the molecular structure parameters by selecting specific polyfunctional cores with controlled numbers of thiol groups (3-6 thiol groups per molecule). This parameter optimization achieves tack-free performance while maintaining high elongation and low elasticity, avoiding the need for overly complex molecular structures.
3Productivity
If a thiol compound is used to achieve rapid curing of epoxy resins, then the curing process completes quickly, but the compound must be carefully selected to avoid surface adhesion issues
Solution Approach 1:
The patent changes the reactivity parameters of the thiol compound by selecting polyfunctional structures with specific steric configurations. The polyfunctional cores (pentaerythritol, dipentaerythritol, trimethylolpropane) provide optimized reactivity for rapid curing while their molecular structures prevent surface adhesion, achieving both high productivity and tack-free performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thiol compound achieves rapid curing of epoxy resins while providing a cured product with good tack-free properties and excellent impact resistance.
Implementation Method 1
a compound having a plurality of thiol groups within the molecule have been subjected to various research
Implementation Method 2
by using a bifunctional thiol compound with a long molecular chain, it is possible to obtain a cured product having high elongation and low elasticity
Data Source
Figure 1
AI summary
The present invention is to provide a novel thiol compound used for curing of epoxy resins, etc. Specifically, the present invention is to provide a compound represented by the general formula (I), a curing agent for epoxy resins, and an epoxy resin composition comprising the compound of formula (I).