Thiol Compound Protective Layer for Laser Patterning
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Solution Overview
Problem
Conventional methods for forming patterned structures on substrates, such as photolithography and electroplating, are costly and require expensive equipment, multiple chemicals, and complex processes, necessitating a more efficient and cost-effective approach.
Innovation Solution
A method involving the formation of a substrate structure using a thiol compound as a protective layer, which is patterned using laser treatment, allowing for the deposition of a second metal layer without the need for masks or additional fixtures, and utilizing electroless plating for metal deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography and electroplating are used to form patterned structures, then manufacturing precision is improved, but device complexity and manufacturing cost increase due to expensive equipment, masks, and chemical processes
Solution Approach 1:
The patent extracts and eliminates the need for expensive photolithography equipment, masks, and complex electroplating systems by using a simple laser-based approach. The laser directly patterns the thiol compound without requiring masks or specialized equipment, thereby reducing device complexity while maintaining pattern formation precision.
Solution Approach 2:
The patent replaces the mechanical photolithography system with a laser-based system. Instead of using optical masks and photoresist, the laser directly modifies the thiol compound to create patterns, substituting a complex mechanical/optical system with a simpler optical/thermal process that achieves the same patterning function.
2Manufacturing precision
If conventional electroplating is used to deposit metal layers, then manufacturing precision is improved, but manufacturing cost increases due to equipment, electrodes, and plating solution requirements
Solution Approach 1:
The patent uses a disposable thiol compound layer that can be easily applied and removed, replacing expensive, reusable electroplating equipment and plating solutions. The thiol compound serves as a temporary mask that is deposited via simple coating processes and then removed by laser irradiation, eliminating the need for costly electroplating infrastructure.
Solution Approach 2:
The patent replaces the electrochemical electroplating process with a laser-based thermal process. Instead of using electrical current to deposit metal, the laser directly patterns the thiol compound and enables subsequent metal deposition through a simplified chemical process, substituting a complex electrochemical system with a simpler optical/chemical approach.
3Manufacturing precision
If photolithography and electroplating processes are used, then manufacturing precision is improved, but loss of time increases due to multiple steps including resin spraying, curing, and equipment setup
Solution Approach 1:
The patent applies the thiol compound layer in advance as a preparatory step that enables subsequent laser patterning and metal deposition. This preliminary coating step simplifies later processes by providing a ready-to-pattern surface, eliminating the need for separate resin spraying and curing steps, thereby reducing overall manufacturing cycle time.
Solution Approach 2:
The patent creates a continuous process where the thiol compound layer is deposited, patterned by laser, and processed to form metal structures in an uninterrupted sequence. This eliminates the discontinuous steps of resin spraying, curing, and multiple setup phases required in conventional methods, maintaining useful action continuously and reducing total manufacturing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of complex patterns with high resolution and low production costs, reducing equipment requirements and eliminating the need for polymeric resins, while maintaining precise dimensions and facilitating mass production.
Implementation Method 1
forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer
Implementation Method 2
patterning the second protective layer to form a pattern having an opening exposing the first protective layer
Data Source
AI summary
The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.