Threaded Heat Sink Mounting on Module Lid
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Solution Overview
Problem
Existing heat sink mounting methods in electronic circuits face issues with space utilization, adjustability, pressure distribution, thermal conductivity, and durability, as they rely on non-adjustable hardware and low-performing adhesive thermal interface materials.
Innovation Solution
A novel heat sink mounting method using a threaded module lid and heat sink base pocket allows for adjustable mechanical and thermal contact, enabling controlled pressure and optimal airflow alignment, eliminating the need for board-level hardware and enhancing thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If mounting hardware (clips, screws, springs) is used to attach heat sink, then mechanical retention is achieved, but board space is consumed and adjustability is lost
Solution Approach 1:
The patent merges the mounting hardware function into the module lid itself by integrating threaded portions directly into the lid structure. This eliminates the need for separate clips, screws, or springs, thereby retaining mechanical strength while freeing up board space. The heat sink is attached through threads formed in the lid, combining the retention function with the lid component.
Solution Approach 2:
The patent extracts the mounting hardware from the system by eliminating separate clips, screws, and springs. Instead, the retention function is achieved through integrated threaded portions in the module lid, removing the need for additional board-level mounting components and reducing overall board space requirements.
2Strength
If non-adjustable mounting hardware is used, then mechanical retention is achieved, but pressure distribution and thermal conductivity are compromised
Solution Approach 1:
The patent introduces adjustability by allowing the heat sink to be screwed to different depths on the threaded portions of the module lid. This dynamic adjustment capability enables optimization of pressure distribution and thermal contact between the heat sink and the module, while maintaining secure mechanical retention through the threaded connection.
3Temperature
If adhesive thermal interface material is used alone, then thermal conduction is achieved, but thermal performance is insufficient and rework is difficult
Solution Approach 1:
The patent uses a composite mounting approach combining mechanical threaded retention with adhesive thermal interface material. The threaded connection provides structural support and adjustable pressure, while the adhesive TIM ensures optimal thermal contact. This composite solution overcomes the limitations of using adhesive alone, achieving both strong retention and high thermal performance.
4Strength
If mounting hardware is used, then mechanical retention is achieved, but the system lacks electromagnetic interference protection
Solution Approach 1:
The patent merges the EMI shielding function with the mounting structure by making the module lid itself conductive and integrating it into the thermal and mechanical path. The conductive lid provides EMI protection while simultaneously serving as the mounting structure with threaded portions for heat sink attachment, eliminating the need for separate EMI shielding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved thermal conductivity, reduced board space requirements, adjustable pressure distribution, and enhanced electromagnetic interference protection, while maintaining high thermal performance and signal integrity.
Implementation Method 1
a solid mechanical and thermal contact is established between the heat sink and the module lid
Implementation Method 2
an airflow from an air moving device flows unobstructed across vanes on the heat sink
Data Source
AI summary
A method affixes a heat sink to a module lid. A module lid is mounted to a substrate by use of a lid adhesive. The module lid has a threaded exterior portion. The module lid is thermally interfaced to a die by use of a thermal interface material. The heat sink is then screwed onto a module lid, where the heat sink includes a threaded heat sink base pocket that mates with the threaded exterior portion of the module lid, and wherein the heat sink is screwed down onto the module lid until 1) a solid mechanical and thermal contact is established between the heat sink and the module lid, and 2) an airflow from an air moving device flows unobstructed across vanes on the heat sink.