Three-axis magnetic sensor single-chip integration
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Solution Overview
Problem
Current three-axis magnetic sensors face challenges with complex packaging processes, large package sizes, and high costs due to the encapsulation of multiple single-axis sensor dies, as well as sensitivity variations along different axes.
Innovation Solution
A single-chip three-axis magnetic sensor design incorporating a two-axis magnetic sensing structure with Wheatstone bridge configurations and a single-axis push-pull Wheatstone bridge configuration, utilizing a substrate with magnetoresistors and soft magnetic flux guides to measure X, Y, and Z components of the magnetic field, integrated with semiconductor circuits for reduced complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If three single-axis sensor dies are encapsulated into the same package to achieve three-axis magnetic field measurement, then measurement capability is improved, but device complexity and packaging difficulty increase
Solution Approach 1:
The patent merges three single-axis sensor dies into a single integrated three-axis magnetic sensor device. The first and second single-axis magnetic sensors are mounted on the same substrate and electrically connected to form a unified three-axis measurement system, eliminating the need for separate packaging of multiple dies and reducing packaging complexity.
Solution Approach 2:
The invention creates a universal three-axis magnetic sensor that can measure magnetic field components along X, Y, and Z axes simultaneously. The first single-axis sensor measures horizontal components (X and Y), while the second single-axis sensor measures vertical component (Z), providing multi-functional capability in a single device.
2Adaptability or versatility
If multiple single-axis sensor dies are used to achieve three-axis measurement, then measurement capability is improved, but package size increases
Solution Approach 1:
The patent employs a nested structure where the second single-axis magnetic sensor is positioned on top of the first single-axis sensor. This vertical stacking arrangement allows the Z-axis measurement sensor to be nested above the X-Y plane sensors, significantly reducing the overall package footprint compared to horizontal arrangement of separate dies.
Solution Approach 2:
The invention transitions from a two-dimensional horizontal arrangement of sensor dies to a three-dimensional vertical stacking configuration. By placing the second single-axis sensor vertically above the first sensor, the design utilizes the Z-dimension for physical arrangement, thereby reducing the horizontal package area.
3Adaptability or versatility
If multiple single-axis sensor dies are encapsulated to achieve three-axis measurement, then measurement capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple single-axis sensor dies into a single integrated package with shared packaging structures and electrical connections. By mounting both single-axis sensors on the same substrate and using common packaging elements, the manufacturing cost is reduced compared to producing and packaging three separate single-axis sensor devices.
Solution Approach 2:
The invention creates a universal three-axis magnetic sensor platform that can be manufactured using standardized processes for mounting and connecting single-axis sensors. This multi-functional design allows reuse of packaging and interconnection technologies, reducing overall manufacturing complexity and cost.
4Adaptability or versatility
If three identical sensor dies are arranged with two in X-Y plane and one vertically for three-axis measurement, then measurement capability is improved, but sensitivity variation along different axes increases
Solution Approach 1:
The patent applies local quality by using two different single-axis magnetic sensor types optimized for different measurement orientations. The first sensor is optimized for horizontal field components with its sensitive axis perpendicular to the easy magnetization direction, while the second sensor is optimized for vertical field components. This localized optimization compensates for sensitivity variations that would occur with identical sensors arranged in different orientations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a low-cost, highly integrated solution with improved sensitivity and reduced interference, enabling efficient measurement of magnetic field components along all axes while minimizing packaging complexities and size.
Implementation Method 1
Four magnetoresistors R1, R3, R5, R7 are placed respectively in the four gaps, and another four magnetoresistors R2, R4, R6, R8 are placed and shielded under the magnetic flux guide
Implementation Method 2
a two-axis magnetic sensing structure consisting of two Wheatstone bridge configurations in conjunction with an annular or semi annular magnetic flux-guiding structure
Data Source
AI summary
A three-axis magnetic sensor apparatus is described that is processed together into a single chip, with high performance, low cost, as well as small size. The three-axis magnetic sensor apparatus include a substrate, a two-axis magnetic sensing structure and a single-axis sensing structure. The two-axis sensing magnetic structure consisting of two shielded Wheatstone bridge configurations in conjunction with an annular or semi annular magnetic flux-guiding structure, and the single-axis sensing structure consisting of a push-pull Wheatstone bridge in conjunction with a flux guide that is capable of generating a fringe field whose horizontal component is proportional to the vertical component of an external magnetic field. The two-axis magnetic sensing structure and the single-axis structure are processed together into a single chip, and can be used to measure respectively X, Y and Z components of external magnetic fields.