Three-axis Sensor Module Orthogonal Array Design
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Solution Overview
Problem
Current stand-alone multi-axis sensor chips for three-dimensional measurements lack precision and resolution, and configurations using multiple single-axis sensors on the same plane lead to suboptimal spacing and measurement inaccuracies due to temperature variations and differences in sensor models and placement.
Innovation Solution
A three-axis measurement module with an array of single-axis sensors of the same make and model, oriented to measure orthogonal axes intersecting at a common point, minimizing variance and temperature sensitivity, and incorporating temperature sensors for compensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple single-axis sensors are placed on the same physical plane of a PCB, then the device complexity is reduced and ease of manufacture is improved, but measurement precision deteriorates due to suboptimal sensor spacing and temperature variations affecting different sensors differently
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of sensors on a PCB to a three-dimensional configuration where sensors are positioned at different heights and angles. The mounting element holds sensors in a spatial arrangement where they are angled away from a common mounting plane, allowing optimal spacing and reducing temperature variation effects while maintaining manufacturing feasibility through a unified mounting structure.
Solution Approach 2:
The patent introduces a specialized mounting element as an intermediary component between the PCB and the sensors. This mounting element facilitates the complex three-dimensional sensor arrangement by providing integrated support, positioning, and angular orientation for multiple sensors, thereby simplifying the assembly process despite the increased spatial complexity.
2Device complexity
If sensors of different makes and models are used to cover all three axes, then device complexity is reduced, but measurement precision deteriorates due to differences in resolution and temperature sensitivity
Solution Approach 1:
The patent applies homogeneity by using three sensors of the same make and model for measuring along the three orthogonal axes. This ensures that all sensors have identical resolution characteristics and temperature sensitivity, eliminating the precision inconsistencies that arise from mixing different sensor types while still achieving complete three-axis coverage.
3Reliability
If sensors are positioned with larger spacing to accommodate temperature variations, then reliability is improved, but measurement precision deteriorates due to increased distance from the common measurement point
Solution Approach 1:
The patent resolves this contradiction by utilizing the third dimension (vertical height and angular orientation) to position sensors. Sensors are angled away from a common mounting plane at optimized angles, allowing them to be physically separated to reduce temperature coupling while their measurement axes still converge at or near a common intersection point in three-dimensional space, thereby maintaining measurement accuracy.
Data Source
AI summary
Sensor modules for measuring parameters such as magnetic fields, tilts, orientation, or other parameters in high resolution in three orthogonal axes using single-axis sensor arrays are disclosed.