Three-Dimensional Heat Transfer Layout for Lower Air Resistance

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Solution Overview

Problem

Conventional heat dissipation devices face challenges in improving heat dissipation efficiency due to limitations in the design of thermal conductive plates and heat pipes, leading to inefficiencies in heat transfer and air resistance.

Innovation Solution

A three-dimensional heat transfer device is designed with flatten heat pipes arranged along the extension direction of a vapor chamber, where the major axes of their cross-sections are parallel to the long side of the chamber, reducing the total windward area and air resistance to enhance heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional heat pipes are used in heat dissipation devices, then heat transfer function is provided, but air resistance increases and heat dissipation efficiency is limited

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidair resistance
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The heat pipes are designed with an asymmetric flattened configuration where the cross-sectional shape is elliptical rather than circular. The major axis of the ellipse is oriented parallel to the airflow direction, creating an asymmetric arrangement that minimizes the windward area presented to the airflow while maintaining sufficient heat transfer surface area on the sides perpendicular to flow direction.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The invention transitions from conventional circular cross-section heat pipes to flattened heat pipes with elliptical cross-sections. This dimensional transformation reorients the heat pipe geometry so that the longer dimension (major axis) aligns with the airflow direction, effectively reducing the projected area facing the airflow while preserving heat transfer capability through the flattened structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If more heat pipes are added to increase heat dissipation capacity, then heat transfer capability improves, but device complexity and space occupation increase

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidstructure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

Multiple flattened heat pipes are arranged in parallel with their major axes aligned, creating a compact integrated heat dissipation structure. The flattened configuration allows multiple heat pipes to be closely spaced without significantly increasing the overall footprint, as the reduced windward area of each pipe enables tighter packing while maintaining airflow efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly increases the heat dissipation efficiency by minimizing air resistance and optimizing the arrangement of heat pipes, allowing for more effective heat transfer from the heat source to the environment.

Implementation Method 1

when the thermal conductive plate absorbs heat generated from the heat source, the heat vaporizes a working fluid inside the thermal conductive plate, and the vaporized working fluid flows from ends of the heat pipes located close to the thermal conductive plate to the other ends thereof located close to the heat dissipation assembly. Then, the vaporized working fluid is condensed by the heat dissipation assembly

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

The heat pipes connect the thermal conductive plate with the heat dissipation assembly, and capillary structures inside the heat pipes are thermally coupled to a capillary structure inside the thermal conductive plate

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 3

the liquid working fluid flows back to the thermal conductive plate with the help of the capillary structures in the heat pipes and the thermal conductive plate

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 4

uses a heat dissipation assembly (e.g., a fan and fins) to dissipate heat to outside environment

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 5

uses a heat dissipation assembly (e.g., a fan and fins) to dissipate heat to outside environment

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS12366419B2Three-dimensional heat transfer device
Publication Date: 2025.07.22 PURPLE CLOUD DEV PTE LTD
  • US12366419B2 patent drawing
  • US12366419B2 patent drawing
  • US12366419B2 patent drawing

AI summary

A three-dimensional heat transfer device includes a vapor chamber and a plurality of flatten heat pipes. The flatten heat pipes are disposed on the vapor chamber and arranged along an extension direction of a short side of the vapor chamber. Major axes of cross-sections of the flatten heat pipes are parallel to a long side of the vapor chamber.