Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Three-dimensional integrated circuit structures face challenges in dissipating heat generated by high-power components within the stack, as middle chips are not exposed to ambient air, necessitating an efficient cooling mechanism.

Innovation Solution

A thermoelectric cooling system is implemented using a thermoelectric cooling daisy chain of vias connected in series surrounding the chip stack, electrically connected to a thermoelectric cooling plate and a heat sink, allowing heat to be directed and dissipated from the stack into the ambient environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple chips are bonded together to form a 3D chip stack, then the device achieves higher integration and compactness, but chips in the middle are not exposed to ambient air and cannot dissipate heat effectively

Engineering Contradiction:

Improvedevice compactnessVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

A thermoelectric cooling plate is introduced as an intermediary component between the chip stack and the heat sink. This plate contains embedded heating elements and thermocouples that actively pump heat from the interior chips to the exterior heat sink, mediating the heat transfer path that would otherwise be blocked by the stacked structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The passive convection-based heat dissipation mechanism (relying on ambient air exposure) is replaced with an active thermoelectric cooling system. The thermoelectric plate uses electrical energy to drive heat transfer against the temperature gradient, substituting the mechanical/physical convection process with an electromechanical cooling system.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If a thermoelectric cooling system is added to cool middle chips, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidcooling mechanism complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermoelectric cooling plate serves multiple functions simultaneously: it acts as a heat pump for interior chips, provides thermal coupling between chips and heat sink, and incorporates temperature sensing through embedded thermocouples. This multi-functionality reduces the need for separate components and simplifies the overall system architecture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cooling mechanism is merged with the structural framework of the device. The thermoelectric plate is integrated into the chip stack assembly, combining the cooling function with the mechanical support structure, thereby avoiding the need for separate cooling housings or mounting systems.

Inventive Principle:

Principle #5Merging (Combining)

3Power

If high-power CPU chips are used in a 3D stack, then processing performance is improved, but heat generation increases requiring additional cooling mechanisms

Engineering Contradiction:

Improveprocessing performanceVSAvoidheat generation

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The waste heat generated by high-power CPU chips is converted into a useful resource. The thermoelectric cooling system captures this waste heat and transports it to the heat sink, where it can be dissipated. The heating elements in the thermoelectric plate utilize electrical energy to drive this heat transfer, effectively managing the harmful thermal byproduct of high-performance processing.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively dissipates heat from high-power components within the 3D chip stack, ensuring efficient cooling even for chips not exposed to ambient air, thereby maintaining performance and preventing overheating.

Implementation Method 1

passing an electrical current through the thermoelectric cooling daisy chain and the thermoelectric cooling plate to direct heat generated in the three-dimensional chip stack into the thermoelectric cooling plate and the heat sink

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

dissipating the generated heat from the heat sink into an ambient environment

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

dissipating the generated heat from the heat sink into an ambient environment

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9847272B2Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures

Publication Date: 2017.12.19 GLOBALFOUNDRIES SINGAPORE PTE LTD

AI summary

Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures are disclosed. In one exemplary embodiment, a three-dimensional integrated circuit structure includes a plurality of integrated circuit chips stacked one on top of another to form a three-dimensional chip stack, a thermoelectric cooling daisy chain comprising a plurality of vias electrically connected in series with one another formed surrounding the three-dimensional chip stack, a thermoelectric cooling plate electrically connected in series with the thermoelectric cooling daisy chain, and a heat sink physically connected with the thermoelectric cooling plate.