Three-Dimensional Liquid Cooling with Vapor Chambers and Heat Pipes

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Solution Overview

Problem

Conventional cooling devices, including integrated vapor chambers and heat pipes, fail to achieve sufficient three-dimensional heat transfer efficiency to meet user requirements.

Innovation Solution

A liquid cooling system incorporating a cooling chamber and a three-dimensional heat transmission apparatus comprising a vapor chamber and heat pipes, where the vapor chamber is thermally coupled to a heat source via a cooling chamber, with a cooling cycle involving a second cooling fluid and a flow of a first cooling fluid to enhance heat removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional cooling devices use heat pipes or vapor chambers independently, then the structure is simple, but the heat transfer efficiency is insufficient due to one-dimensional or two-dimensional heat transfer only

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidstructure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent combines a vapor chamber and heat pipes into an integrated three-dimensional heat transmission apparatus. The heat pipes are arranged vertically on the vapor chamber, creating a merged structure that enables heat transfer in multiple dimensions simultaneously, thereby improving heat transfer efficiency while maintaining reasonable structural complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from conventional one-dimensional (heat pipes) or two-dimensional (vapor chamber) heat transfer to three-dimensional heat transfer by vertically arranging heat pipes on the vapor chamber. This dimensional expansion allows heat to be transmitted more efficiently from the heat source through multiple pathways in different directions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If integrated vapor chambers and heat pipes are used for three-dimensional heat transfer, then the heat transfer capability is improved, but the heat transfer efficiency is still insufficient to meet user requirements

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcooling performance adequacy
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces a cooling chamber as an intermediary component between the heat source and the three-dimensional heat transmission apparatus. The cooling chamber accommodates a cooling fluid that circulates to absorb heat from the vapor chamber and heat pipes, enhancing the overall cooling efficiency and ensuring adequate cooling performance

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes a cooling fluid circulating through the cooling chamber to remove heat from the three-dimensional heat transmission apparatus. This hydraulic cooling mechanism efficiently transfers heat away from the heat source, improving overall cooling efficiency and meeting user performance requirements

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system improves cooling efficiency by utilizing a combined cooling cycle of both fluids, effectively transferring heat in three dimensions, enhancing overall cooling performance.

Implementation Method 1

The working fluid absorbs heat and vaporizes in the evaporation area to rapidly spread to the entire interior space. The vaporized working fluid dissipates heat and condenses back into a liquid form in the condensation area

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

The vaporized working fluid dissipates heat and condenses back into a liquid form in the condensation area and then returns to the evaporation area via the capillary structure

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 3

The at least one heat pipe is disposed on the vapor chamber

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250275095A1Liquid cooling system and electronic device
Publication Date: 2025.08.28 INVENTEC PUDONG TECH CORPOARTION
  • US20250275095A1 patent drawing
  • US20250275095A1 patent drawing
  • US20250275095A1 patent drawing

AI summary

An electronic device is configured to accommodate a first cooling fluid and a second cooling fluid, and includes a heat source and a liquid cooling system. The liquid cooling system includes a cooling chamber and a three-dimensional heat transmission apparatus. The cooling chamber is configured to accommodate the first cooling fluid. The three-dimensional heat transmission apparatus is disposed in the cooling chamber, and is configured to accommodate the second cooling fluid. The three-dimensional heat transmission apparatus includes a vapor chamber and at least one heat pipe. The vapor chamber is configured to be thermally coupled to the heat source via the cooling chamber. The at least one heat pipe is disposed on the vapor chamber.