Three-Dimensional Vapor Chamber with Integrated Capillary Heat Paths
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Solution Overview
Problem
Existing three-dimensional vapor chambers face inefficiencies in heat dissipation, which affect the working reliability and efficiency of electronic devices due to increased computing power and ambient temperatures.
Innovation Solution
A three-dimensional vapor chamber design incorporating a vapor chamber module and a heat pipe capillary structure, featuring interconnected upper and lower shell capillary structures and a heat pipe module, enhances fluid flow efficiency through expanded and raised capillary connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional vapor chamber structure is used, then manufacturing is simpler, but heat dissipation efficiency is insufficient
Solution Approach 1:
The heat pipe capillary structure is nested within the vapor chamber shell, with the capillary structure forming an integrated network inside the sealed chamber. This nesting approach allows the heat pipe functionality to be incorporated into the vapor chamber structure without requiring separate external components, thereby improving heat dissipation efficiency while controlling structural complexity
Solution Approach 2:
The invention transitions from traditional two-dimensional flat vapor chamber structures to three-dimensional multi-layer configurations with raised joint portions and expansion joint portions. This dimensional enhancement creates additional capillary pathways and increases the effective heat dissipation surface area, significantly improving heat transfer efficiency
2Power
If computing power is increased, then processing capability is improved, but temperature control becomes more difficult
Solution Approach 1:
The vapor chamber utilizes phase transition of the working fluid between liquid and vapor states to absorb and transport heat. The heating portion evaporates liquid to absorb heat from high-power processors, while the cooling portion condenses vapor to release heat, enabling effective temperature control in high-performance computing applications
Solution Approach 2:
The capillary structure employs porous materials with controlled pore sizes and distributions to facilitate capillary-driven fluid circulation. The porous structure provides extensive surface area for heat exchange and maintains fluid flow without requiring external pumps, enabling passive yet effective thermal management for high-power devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced fluid flow and capillary connections improve heat dissipation efficiency, maintaining system stability and improving the working reliability of electronic components.
Implementation Method 1
an upper shell capillary structure (150) formed in the upper shell body (120)... a heat pipe capillary structure (160) formed in the heat pipe shell (130)... the heat pipe capillary structure (160) is connected to the upper shell capillary structure (150)
Implementation Method 2
The three-dimensional vapor chamber combined the vapor chamber and the heat pipe may be connected to the heat source that needs to dissipate heat... transfer the heat to the heat sink fins or other heat dissipation devices
Data Source
AI summary
A three-dimensional vapor chamber includes a vapor chamber module and a heat pipe module. The vapor chamber module includes an upper shell structure, and the upper shell structure includes an upper shell body and an upper shell capillary structure formed in the upper shell body. The heat pipe module is fixed on the vapor chamber module and in fluid communication with the vapor chamber. In addition, the heat pipe module includes a heat pipe shell fixed on the upper shell body, and a heat pipe capillary structure formed in the heat pipe shell and connected to the upper shell capillary structure.