Three-Layered Temporary Adhesive for High-Temperature Wafer Processing
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Solution Overview
Problem
Existing wafer processing technologies face challenges in achieving uniform film thickness, heat resistance, and easy separation of thin wafers, especially at high temperatures exceeding 300°C, while maintaining compatibility with TSV and wiring formation processes.
Innovation Solution
A three-layered temporary adhesive material layer comprising a thermoplastic organopolysiloxane polymer layer, a thermosetting siloxane-modified polymer layer, and another thermoplastic organopolysiloxane polymer layer, with specific thicknesses and peeling forces, is used to bond the wafer and support, enabling uniform film formation and high-temperature resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single-layer temporary adhesive material is used, then the structure is simple and easy to manufacture, but it cannot provide both uniform film thickness formation and sufficient heat resistance exceeding 300°C
Solution Approach 1:
The temporary adhesive material is divided into three distinct layers: a first temporary adhesive layer (5-50 nm thick) for uniform film formation and bonding, a second temporary adhesive layer (50-200 nm thick) for heat resistance and mechanical strength, and a third temporary adhesive layer (5-50 nm thick) for easy separation. This segmentation allows each layer to specialize in specific functions, achieving both uniformity and heat resistance without requiring a single complex material
Solution Approach 2:
The invention uses a composite structure combining three different temporary adhesive materials with distinct properties. The first and third layers use materials optimized for thin-film uniformity and release, while the second layer uses a material optimized for high-temperature stability. This composite approach enables the adhesive assembly to simultaneously achieve uniform film thickness, heat resistance exceeding 300°C, and easy separation
2Strength
If a thick temporary adhesive layer is used, then it provides sufficient bonding strength and heat resistance, but it prevents uniform film thickness formation and complicates separation
Solution Approach 1:
Instead of using a single thick adhesive layer, the invention segments the adhesive into three thin layers with total thickness comparable to or less than conventional single layers. Each layer is optimized for specific functions: the first layer (5-50 nm) ensures uniform film formation, the second layer (50-200 nm) provides bonding strength and heat resistance, and the third layer (5-50 nm) facilitates separation. This segmentation achieves sufficient strength while maintaining uniformity
Solution Approach 2:
The invention changes the thickness parameter of each adhesive layer to be in the range of 5-200 nm, which is significantly thinner than conventional single-layer adhesives. This parameter change enables uniform film thickness formation while the composite structure compensates for the reduced individual layer thickness by providing cumulative bonding strength and heat resistance through the three-layer configuration
3Ease of operation
If a single-layer temporary adhesive material is used, then the structure is simple, but it cannot provide easy separation after high-temperature processing
Solution Approach 1:
The adhesive structure is segmented into three layers where the third layer (5-50 nm) is specifically designed as a release layer with low adhesion to the substrate. This thin outer layer can be easily removed after high-temperature processing, exposing the second layer which maintains bonding during processing. The segmentation allows easy separation while maintaining structural integrity during manufacturing
Solution Approach 2:
The invention inverts the conventional approach by placing the easiest-to-remove layer (third layer) on the outer surface that contacts the substrate, rather than having the strongest bonding layer on the outside. This inversion allows the third layer to serve as a sacrificial release layer that protects the underlying second layer during processing and enables easy separation afterward, while the second layer provides the necessary bonding strength
4Strength
If conventional organic resin tape is used, then it provides flexibility, but it lacks sufficient strength and heat resistance for TSV and wiring formation steps
Solution Approach 1:
The invention creates a composite temporary adhesive structure combining three materials with complementary properties. The second layer (50-200 nm) uses a material with high heat resistance and mechanical strength to withstand TSV and wiring formation steps at temperatures exceeding 300°C. The first and third layers (5-50 nm each) use materials optimized for uniform film formation and easy separation. This composite structure provides both the required strength/heat resistance and versatility for multiple processing steps
5Ease of manufacture
If laser irradiation is used to remove the temporary adhesive layer, then the adhesive can be decomposed, but expensive tools and long treatment time are required
Solution Approach 1:
The third temporary adhesive layer (5-50 nm) is designed as a thin, sacrificial release layer that can be easily removed by simple mechanical means such as peeling or rinsing, without requiring expensive laser equipment. This thin outer layer acts as a disposable protective coating that facilitates easy separation of the substrate from the support, dramatically reducing treatment time and equipment costs compared to laser decomposition methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the efficient production of thin wafers with excellent heat resistance and uniformity, facilitating the formation of TSVs and wiring layers, and enables easy separation, thereby increasing productivity.
Implementation Method 1
a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer (A) and releasably laminated to the front surface of the wafer
Implementation Method 2
the first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer (A) has a thickness of less than 100 nm
Implementation Method 3
a second temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (B) releasably laminated to the first temporary adhesive layer
Data Source
Figure 1
AI summary
The present invention is a wafer processing laminate including a support (3), a temporary adhesive material layer (2) formed on the support, and a wafer (1) stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, wherein the temporary adhesive material layer comprises a three-layered complex temporary adhesive material layer that includes a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer (A) having a thickness of less than 100 nm and releasably laminated to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (B) releasably laminated to the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer (A') having a thickness of less than 100 nm, releasably laminated to the second temporary adhesive layer, and releasably laminated to the support. This wafer processing laminate can withstand a thermal process at a high temperature exceeding 300°C, and can increase productivity of thin wafers.