Three-Layer Base Plate Design for Uniform Heating in Food Processors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing base parts for food processors experience uneven heating and temperature distribution, leading to hotspots and inefficient cooking, particularly when thick-film heating elements fail due to large local temperature differences.
Innovation Solution
A base part design featuring a first plate element in contact with food, a second plate element connected to electrical heating elements, and a third plate element with higher thermal conductivity than the first, acting as a thermal mass for uniform heat distribution. The plate elements are soldered together for intimate contact and efficient heat transfer, with the third plate element being thicker and having a higher thermal conductivity than the second, ensuring even heating and temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a direct connection between heating elements and the first plate element is used, then heating efficiency is improved, but temperature distribution becomes uneven causing hotspots
Solution Approach 1:
The patent introduces a second plate element as an intermediary between the heating elements and the first plate element. This intermediate layer helps distribute heat more evenly across the heating surface, preventing direct concentration of heat at specific points while maintaining efficient heat transfer from the heating elements to the food.
Solution Approach 2:
The patent employs a composite structure consisting of three different plate elements, each with specific material properties. The first plate element has high thermal conductivity for efficient heat transfer, the second plate element provides structural support and additional heat distribution, and the third plate element offers thermal mass for temperature stabilization. This composite approach balances heating efficiency with uniform temperature distribution.
2Ease of manufacture
If plate elements are connected with loose contact, then manufacturing is easier, but heat transfer efficiency decreases
Solution Approach 1:
The patent applies solder plating to the plate elements before assembly. This preliminary surface treatment ensures that when the plates are joined, they form intimate thermal contact with excellent heat transfer efficiency. The solder plating is applied in advance to the surfaces that will be in contact, guaranteeing optimal thermal coupling without requiring complex assembly procedures.
3Temperature
If the third plate element has high thermal conductivity, then heat distribution uniformity is improved, but thermal mass decreases
Solution Approach 1:
The patent assigns different thermal properties to different plate elements based on their specific functions. The third plate element, which serves as a heat distribution layer, is made with high thermal conductivity to ensure uniform heat spread. The first plate element, which contacts the food, is made with lower thermal conductivity to provide thermal mass and stabilize temperature. This localized optimization of material properties resolves the contradiction between heat distribution and thermal mass.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves uniform heating and temperature distribution across the first plate element in contact with food, preventing hotspots and ensuring even cooking, while the thermal mass of the third plate element provides robustness and simplified control of the heating elements, reducing the risk of element failure.
Implementation Method 1
The base part has a third plate element, the top side of which is connected to an underside of the first plate element. A bottom of the third plate member is connected to a top of the second plate member. The third plate element has a higher thermal conductivity than the first plate element.
Implementation Method 2
to solder the third panel element and the first panel element to one another, the underside of the first panel element and/or the top side of the third panel element can be provided with a solder, in particular with a solder plating, which then melts during soldering and is used for the material connection of the third panel element with the first plate element
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention relates to a base (10) for a food processor designed for heating at least one food item, comprising a first plate element (12) whose upper surface (14) is in contact with the at least one food item during operation of the base (10), and a second plate element (16) which is connected to at least one electrical heating element (20, 22) of the base (10). The base (10) has a third plate element (26) whose upper surface (28) is connected to a lower surface (30) of the first plate element (12), and whose lower surface (32) is connected to an upper surface (34) of the second plate element (16). The third plate element (26) has a higher thermal conductivity than the first plate element (12).