Three-Level Interconnect Clip for Balanced Package Heat Dissipation
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Solution Overview
Problem
Current semiconductor packages face inefficiencies and cost issues in achieving balanced heat extraction, leading to asymmetric temperature distribution and potential damage from high temperatures on one side of the package due to ineffective thermal dissipation solutions.
Innovation Solution
An interconnect clip with a three-level design featuring a die attach pad, a heat dissipation pad, and a lead contact pad, connected by bridge sections, providing direct thermal dissipation and electrical conduction paths, formed from a single sheet of metal with strategically angled and spaced components for enhanced cooling and interconnect capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is mounted on one side of the semiconductor package, then thermal dissipation capability is improved, but asymmetric temperature distribution occurs with dangerously high temperatures on the opposite side
Solution Approach 1:
The heat dissipation function is segmented into two separate heat dissipation pads positioned on opposite sides of the semiconductor package. This segmentation allows heat to be dissipated from both sides simultaneously, preventing asymmetric temperature distribution while maintaining effective thermal dissipation capability.
Solution Approach 2:
The solution transitions from single-sided heat dissipation to dual-sided heat dissipation by adding heat dissipation functionality in the opposite dimension (the other side of the package). This dimensional expansion balances the temperature distribution across the package structure.
2Temperature
If multiple separate components are used to achieve balanced heat extraction, then thermal management effectiveness is improved, but manufacturing cost and complexity increase
Solution Approach 1:
Multiple heat dissipation pads are merged into a single continuous conductive layer that spans across the semiconductor package. This merging reduces the number of discrete components while maintaining the balanced heat extraction function, as the continuous layer provides thermal pathways to both sides of the package.
Solution Approach 2:
The single continuous conductive layer serves multiple functions simultaneously: it acts as a heat spreader, provides electrical connections, and enables dual-sided heat dissipation. This multi-functionality eliminates the need for separate components for each function, reducing overall device complexity.
3Stability of the object's composition
If complex multi-step processing is used to create balanced heat dissipation structures, then thermal symmetry is improved, but manufacturing time and cost increase
Solution Approach 1:
The heat dissipation pads and conductive layers are integrated into the lead frame structure during the initial lead frame fabrication process, before semiconductor die mounting. This preliminary action ensures heat dissipation symmetry is built-in from the start, eliminating the need for subsequent complex assembly steps to achieve thermal balance.
Solution Approach 2:
The heat dissipation structure is merged with the lead frame substrate, creating a monolithic structure that is manufactured in a single process flow. This merging eliminates multiple assembly steps required when using separate heat dissipation components, thereby improving manufacturing efficiency while maintaining thermal symmetry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interconnect clip effectively addresses the challenge of balanced heat dissipation and electrical connectivity, offering efficient thermal management and cost-effective production with minimal processing steps, ensuring stable operation by distributing heat evenly and preventing dangerously high temperatures.
Implementation Method 1
the heat dissipation pad comprises a heat dissipation surface... providing direct thermal dissipation... efficiently removed from the semiconductor die
Implementation Method 2
the die attach pad comprises a die attach surface that is flush against the first surface terminal, the lead contact pad comprises a lead contact surface that is flush against the connection surface... electrically connects the first surface terminal to the connection surface
Data Source
AI summary
An interconnect clip includes a die attach pad that comp includes rises a die attach surface at an inner side of the interconnect clip, a heat dissipation pad that includes a heat dissipation surface at an outer side of the interconnect clip, and a lead contact pad that includes a lead contact surface at an inner side of the interconnect clip or at an outer side of the interconnect clip. The outer side of the interconnect clip in the lead contact pad faces and is spaced apart from the inner side of the interconnect clip in the heat dissipation pad, and the inner side of the interconnect clip in the lead contact pad faces and is spaced apart from the outer side of the interconnect clip in the die attach pad.