Three-Level Inverter Wiring Inductance Reduction
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Solution Overview
Problem
Conventional three-level power conversion apparatuses face issues with increased size and weight due to a four-layer laminate structure, which results in higher wiring inductances and costs, particularly in three-phase systems where the weight increase is significant, and cannot reduce wiring inductances between bi-directional and main switch parts effectively.
Innovation Solution
A three-level power conversion apparatus with a three-layer wiring structure is implemented, where conductors are arranged in a superposed manner to reduce wiring inductance between bi-directional and main switch parts, achieving a smaller and more cost-effective design by minimizing the number of laminated layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a four-layer laminate structure is used to connect conductors, then the wiring inductance between IGBT modules and electrolytic capacitors is reduced, but the apparatus size and weight increase significantly
Solution Approach 1:
The patent extracts the essential function of conductor connection while removing the unnecessary fourth layer. By using only three layers (first layer for positive terminal connection, second layer for negative terminal connection, third layer for intermediate potential point connection), the design achieves the required electrical connections without the additional weight and complexity of a four-layer structure.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement of the three-layer structure, positioning conductors in different layers and directions to optimize electrical connection paths. The first and second conductors are arranged in proximity through insulating material, while the third conductor connects to the intermediate potential point, creating an efficient three-dimensional wiring layout that reduces inductance without requiring a fourth layer.
2Ease of manufacture
If a four-layer laminate structure is used, then conductor connections are achieved, but the manufacturing cost increases
Solution Approach 1:
The patent removes the unnecessary fourth layer from the laminate structure, simplifying the manufacturing process. The three-layer structure (first layer with first conductor, second layer with second conductor, third layer with third conductor) provides all required connections with fewer materials and assembly steps, reducing both manufacturing cost and structural complexity.
Solution Approach 2:
The patent combines multiple conductor functions into the three-layer structure. The first conductor connects the positive terminal to the IGBT module, the second conductor connects the negative terminal to the IGBT module, and the third conductor connects the intermediate potential point to the bi-directional switch. This integrated three-layer design achieves all necessary connections without the complexity of a four-layer laminate.
3Reliability
If conductors are arranged in proximity through insulating material, then wiring inductance is reduced, but the apparatus volume increases
Solution Approach 1:
The patent arranges conductors in a three-dimensional laminate structure with three layers. The first and second conductors are positioned in proximity through insulating material in the vertical dimension, while the third conductor is arranged to connect the intermediate potential point. This spatial arrangement optimizes electrical connection paths and reduces inductance without requiring excessive lateral space.
Solution Approach 2:
The patent implements a nested arrangement where the third conductor is positioned between the first and second conductors in the vertical dimension. The insulating material is integrated within the laminate structure, nesting multiple functional elements (conductors, insulators, connections) in a compact three-layer configuration that minimizes overall apparatus volume.
Data Source
AI summary
Wiring between semiconductor modules and a direct current power supply circuit, which construct a three-level power conversion apparatus, is made to be low inductance, so reduction in size and cost can be attained easily. In cases where a connection is made between direct current power supplies (electrolytic capacitors) and IGBT modules of a three-level inverter, a wiring conductor for a bi-directional switch part is divided into three conductors or two conductors on a same surface, and these conductors are sandwiched by a P conductor and an N conductor, which are arranged at outer sides thereof, respectively, through insulating materials, so a three-layer wiring structure of a sealed structure is formed. As a result, wiring inductance can be made small even with a small number of laminated layers, so that the reduction in size and cost of the apparatus as a whole is achieved.