Three-Phase Semiconductor Unit Layout for Low-Loss Converter Cooling
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Solution Overview
Problem
The increasing capacity of power conversion devices leads to higher heat generation per semiconductor element, increasing the cooling burden and making conventional multi-stacked layouts of three-phase in one enclosure semiconductor units impractical due to complex cooling flow paths and pressure losses.
Innovation Solution
A power conversion device design where two three-phase in one enclosure semiconductor units with the same structure are arranged in the housing, with the cooler located in the outer portion and AC terminals facing each other inside, optimizing conductor connections and improving environmental resistance and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple three-phase in one enclosure semiconductor units are stacked in multiple layers in the panel, then the inverter capacity is expanded, but the cooling flow paths become complicated and pressure losses increase
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (multiple layers) to a horizontal side-by-side arrangement of semiconductor units. This dimensional change simplifies the cooling flow paths by allowing cooler air to flow uniformly across all units without navigating complex vertical pathways, thereby reducing pressure losses while maintaining expanded inverter capacity.
Solution Approach 2:
Instead of stacking units vertically (conventional approach), the patent inverts the arrangement by placing units horizontally adjacent to each other. This inversion fundamentally changes the cooling airflow pattern from complex vertical multi-path flow to simpler horizontal flow, resolving the contradiction between capacity expansion and cooling path complexity.
2Power
If multiple three-phase in one enclosure semiconductor units are stacked in multiple layers, then the inverter capacity is expanded, but the number of fans used increases to cool units evenly
Solution Approach 1:
By arranging semiconductor units horizontally in a single layer rather than stacking them vertically, the patent enables uniform cooling airflow to reach all units with fewer fans. The horizontal configuration allows a reduced number of fans to distribute cool air effectively across all units without the need for multiple fans required in vertical stacking to achieve even cooling.
3Reliability
If the semiconductor units and control board are separated from the outside air, then environmental resistance is improved, but the cooling flow paths become complicated and pressure losses increase
Solution Approach 1:
The horizontal arrangement of semiconductor units allows the creation of a protected internal environment that is easily isolated from outside air, while the cooler air intake is positioned to flow uniformly across all units. This dimensional change enables effective environmental protection without complicating the cooling flow paths, as the horizontal layout naturally facilitates simple, direct airflow patterns even within a protected enclosure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the amount of conductors used, simplifies connections, enhances environmental resistance, ensures effective cooling, simplifies cooling flow paths, and improves replaceability of semiconductor units.
Implementation Method 1
a cooler (31), a semiconductor unit (32)
Implementation Method 2
cooling flow paths
Data Source
AI summary
A power conversion device includes: a first alternating current terminal, a second alternating current terminal, and a third alternating current terminal are arranged facing each other inside the housing, the first three-phase in one enclosure semiconductor unit is configured so that a signal distribution board of the power conversion device transmits a U-phase signal to the first alternating current terminal, a V-phase signal to the second alternating current terminal, and a W-phase signal to the third alternating current terminal, and the second three-phase in one enclosure semiconductor unit is configured so that the signal distribution board of the power conversion device replaces wiring so that the U-phase and W-phase are reversed, and transmits a W-phase signal to the first alternating current terminal, a V-phase signal to the second alternating current terminal, and a U-phase signal to the third alternating current terminal.