Three-Sided Bond Wire Pads for High Density IC Packaging
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Solution Overview
Problem
Integrated circuit packaging systems face challenges in increasing input/output (I/O) leads without increasing complexity and cost, as more I/O leads require closer spacing and more wires, leading to difficulties in reliable connections due to wire bonding issues like difficult access and crossed wires.
Innovation Solution
The integration of a bond wire pad row with three-sided bond wire pads that horizontally overlap, forming an interconnection between the device and the substrate, allowing for increased I/O density while minimizing space and reducing wire bonding complexities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of I/O leads is increased to support high functional integration, then the input/output capability is improved, but the interval between leads must decrease and wire bonding complexity increases
Solution Approach 1:
The patent transitions from traditional linear wire bonding to three-dimensional bond wire pads that extend vertically and horizontally. The bond wire pads are configured with sides extending in multiple directions, allowing wires to connect from different spatial dimensions rather than being constrained to a planar arrangement, thereby reducing wire crossing and bonding complexity while maintaining high I/O density
Solution Approach 2:
The bond wire pads are positioned within the substrate structure between the perimeter and the device, nesting the bonding infrastructure within the existing package geometry. This nested arrangement allows multiple bond wire pads to be accommodated in a compact space, increasing I/O leads without proportionally increasing overall package complexity
2Adaptability or versatility
If the number of I/O leads is increased, then the input/output capability is improved, but the interval between leads must decrease leading to smaller contact areas
Solution Approach 1:
The bond wire pads extend in three dimensions with sides that protrude from the substrate surface. This vertical extension adds bonding surface area without increasing the horizontal footprint, allowing smaller lead intervals while maintaining adequate contact area for reliable wire bonding
Solution Approach 2:
Each bond wire pad is segmented into multiple sides extending in different directions. This segmentation allows the total bonding surface area to be distributed across multiple facets, providing adequate contact area for wire bonding even when pads are closely spaced
3Adaptability or versatility
If more wires are required to interconnect I/O leads to bond pads, then the input/output capability is improved, but wire access becomes difficult and wires may cross
Solution Approach 1:
The three-dimensional bond wire pad structure provides multiple accessible faces and sides that protrude from the substrate. Wires can approach and bond to different sides of the pads from various directions, eliminating difficult wire access scenarios and preventing wire crossing by providing spatial separation between bond paths
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a device over a substrate including a bond wire pad row located between a perimeter of the substrate and the device; configuring the bond wire pad row to include three sided bond wire pads that horizontally overlap; and forming an interconnection between the device and the bond wire pad row.