Three-Stack Patch Antenna Structure for Multi-System Signal Reception

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Solution Overview

Problem

Conventional patch antennas are limited in their ability to receive multiple wireless communication system signals efficiently, as they require multiple antennas on a circuit board, leading to increased size and complexity, and struggle with achieving 50-Ohm impedance characteristics, resulting in reduced efficiency.

Innovation Solution

A surface mount type three-stack patch antenna structure comprising three stacked patch antennas with specific feed-in components and a circuit board, and a patch antenna structure with a conducting component to change the radiation pattern, allowing for efficient reception of various wireless communication system signals and improved impedance matching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple separate patch antennas are used to receive different wireless communication system signals, then the reception capability for multiple systems is improved, but the device size and structural complexity increase

Engineering Contradiction:
Improvereception capability for multiple wireless communication systemsVSAvoidstructural complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple patch antennas (first patch antenna for GPS/LBS, second patch antenna for WLAN) into a single integrated antenna structure. The first and second patch antennas are positioned on opposite sides of the base body, sharing common feed-in holes and ceramic components, thereby achieving multi-system reception capability while reducing overall device complexity and size.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If conventional patch antenna structures are used, then the manufacturing process is simple, but achieving 50-Ohm impedance characteristics is difficult resulting in reduced efficiency

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidimpedance matching efficiency
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent employs feed-in holes with specific dimensional parameters (diameter, depth, positioning) to achieve 50-Ohm impedance characteristics. The first and second feed-in holes are configured with precise dimensions and positions to optimize impedance matching for different antenna systems, thereby improving reception efficiency while maintaining manufacturability through standardized ceramic base body fabrication.

Inventive Principle:
Principle #35Parameter changes

3Volume of stationary object

If a single base body is used for multiple antennas, then the device volume is reduced, but the temperature distribution during soldering becomes non-uniform making processing difficult

Engineering Contradiction:
Improveantenna structure volumeVSAvoidsoldering processing ease
Core Design Contradiction:
Volume of stationary objectVSEase of manufacture

Solution Approach 1:

The patent divides the base body into distinct functional regions with through holes positioned to allow separate access for first and second feed-in components. This segmentation enables independent soldering and assembly processes for different antenna systems while maintaining a compact integrated structure, resolving the conflict between volume reduction and manufacturing ease.

Inventive Principle:
Principle #1Segmentation

4Ease of operation

If manual soldering with tapes or glues is used for electrical connection, then the antenna can be connected to mainboard, but automated machine manufacturing is not possible

Engineering Contradiction:
Improveelectrical connection capabilityVSAvoidautomated manufacturing capability
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent designs the base body with pre-configured feed-in holes and grounding structures that automatically provide electrical connection pathways. The first and second feed-in components pass through designated holes and make contact with predetermined contact areas on the mainboard, eliminating the need for manual tape or glue application and enabling automated pick-and-place machine assembly.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS11139550B2Stack antenna structures and methods
Publication Date: 2021.10.05 TAOGLAS GROUP HLDG LTD
  • US11139550B2 patent drawing
  • US11139550B2 patent drawing
  • US11139550B2 patent drawing

AI summary

Three-stack antennas are disclosed which include a first antenna, a second antenna, a third antenna and a circuit board. After the first antenna, the second antenna and the third antennas are stacked on the circuit board orderly, feed-in components are electrically connected to the circuit board. The antenna structures can be surface mounted. The antenna structures can three-feed-in, four-feed-in or five-feed-in configurations, or four-hole or five-hole configurations.