Three-Terminal Clip for Half-Bridge Transistor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current package designs for automotive applications face challenges in simplifying manufacturability while reducing space consumption and maintaining short current paths, particularly for half-bridge configurations with field effect transistors.
Innovation Solution
A package design featuring an electrically conductive chip carrier with two chips interconnected via a three-connection-section clip, allowing for a compact, cost-efficient, and simple half-bridge configuration without the need for complex flip-chip or source-down configurations, utilizing a leadframe-type chip carrier and a clip with curved and web portions to establish connections at different height levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional package designs are used for half-bridge configurations, then reliable electric functionality is achieved, but space consumption increases and manufacturability becomes complex
Solution Approach 1:
The patent combines multiple connection functions into a single integrated clip structure with three connection sections. This clip simultaneously connects the first connection terminal, second connection terminal, and control terminal, eliminating the need for separate connection elements and reducing overall package space while maintaining reliable electrical connections.
Solution Approach 2:
The clip structure serves multiple functions: it provides mechanical support for the terminals, establishes electrical connections between different terminals, and enables the half-bridge configuration. This multi-functional design reduces the number of separate components needed, thereby reducing space consumption while maintaining functionality.
2Reliability
If conventional package designs are used for half-bridge configurations, then reliable electric functionality is achieved, but device complexity and manufacturing effort increase
Solution Approach 1:
The patent merges multiple connection functions into a single integrated clip structure with three connection sections. This clip simultaneously connects the first connection terminal, second connection terminal, and control terminal, eliminating the need for separate connection elements and reducing overall package space while maintaining reliable electrical connections.
Solution Approach 2:
The clip is divided into three distinct connection sections, each responsible for connecting to a specific terminal. This segmentation allows for simplified manufacturing of each section while maintaining the overall integrated structure, reducing manufacturing complexity compared to conventional multi-component designs.
3Reliability
If flip-chip configuration is used, then connection reliability is improved, but manufacturing effort and complexity increase significantly
Solution Approach 1:
Instead of using complex flip-chip configuration where chips are inverted and connected, the patent inverts the connection approach by using a clip structure that connects to terminals on the same side of the chip. This maintains connection reliability while dramatically simplifying the manufacturing process.
Solution Approach 2:
The clip structure is designed to self-align and self-connect with the terminals through its three connection sections, eliminating the need for precise flip-chip alignment and complex bonding processes. The clip inherently provides both mechanical support and electrical connection, reducing manufacturing steps.
Data Source
AI summary
A package which comprises an electrically conductive chip carrier, a first chip comprising a first connection terminal, a second connection terminal located on the chip carrier and a control terminal, a second chip comprising a first connection terminal, a second connection terminal located on the chip carrier and a control terminal, wherein the first chip and the second chip are connected to form a half bridge having inlet terminals and an outlet terminal, and a clip having three connection sections connecting the second connection terminal of the first chip with the first connection terminal of the second chip and with the outlet terminal of the half bridge.