Three-Terminal MLCC Lead Overlap for Low ESL and Withstand Voltage

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Solution Overview

Problem

Three-terminal multilayer ceramic capacitors face issues with reduced dielectric layer thickness due to step differences caused by lead portion thickness variations, leading to decreased withstand voltage and reliability, and require a current path design that minimizes ESL.

Innovation Solution

The multilayer electronic component design includes first and second internal electrodes with extended lead portions that overlap and are positioned to minimize step differences, using dummy electrodes to maintain dielectric layer thickness and enhance capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If lead portions are included to connect internal electrodes to external electrodes, then electrical connection is achieved, but step differences occur causing reduced dielectric layer thickness

Engineering Contradiction:
Improveelectrical connectionVSAvoiddielectric layer thickness
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by extending the lead portions of internal electrodes to overlap with adjacent lead portions before the compression process. This pre-positioning ensures that when external pressure is applied, the overlapping regions maintain consistent dielectric layer thickness without step differences, preventing localized thinning that would occur with conventional non-overlapping designs.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies local quality by creating overlapping regions specifically at the lead portion areas where connections to external electrodes are made. This localized overlap ensures uniform dielectric thickness at critical connection points while allowing other regions to have different configurations, thereby maintaining manufacturing precision where it matters most for electrical reliability.

Inventive Principle:
Principle #3Local quality

2Reliability

If lead portions are extended to reduce ESL, then equivalent series inductance is lowered, but step differences reduce withstand voltage

Engineering Contradiction:
ImproveESL reductionVSAvoidwithstand voltage
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies preliminary action by pre-extending lead portions in a specific overlapping configuration before final assembly. This pre-positioning allows the current path to be optimized for low ESL while ensuring that the overlapping regions maintain uniform dielectric thickness, thereby preserving withstand voltage capability despite the extended lead structure.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies dimensionality change by extending lead portions not only in the planar direction to reduce current path length (lowering ESL) but also in the thickness direction to create overlapping regions. This three-dimensional configuration allows simultaneous optimization of both ESL and dielectric layer uniformity, resolving the contradiction between inductance reduction and voltage withstand capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If internal electrodes are connected to multiple external electrodes, then terminal functionality is achieved, but current path complexity increases

Engineering Contradiction:
Improveterminal functionalityVSAvoidcurrent path design
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-configuring internal electrodes with extended lead portions that naturally overlap with adjacent lead portions. This pre-design simplifies the current path routing to external electrodes, reducing design complexity while maintaining multi-terminal functionality. The overlapping structure provides clear, predictable current paths without requiring complex routing arrangements.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12512269B2Multilayer electronic component
Publication Date: 2025.12.30 SAMSUNG ELECTRO MECHANICS CO LTD
  • US12512269B2 patent drawing
  • US12512269B2 patent drawing
  • US12512269B2 patent drawing

AI summary

A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes stacked in a third direction, and including first and second surfaces in a first direction, and third and fourth surfaces in a second direction; first external electrodes respectively disposed on the first and second surfaces, extended onto the third and fourth surfaces; and second external electrodes respectively disposed on the third and fourth surfaces. The first internal electrode includes a first main portion and first lead portions respectively extended from the first main portion, connected to the first external electrodes, and having a length increased in a direction towards the first main portion, and the second internal electrode includes a second main portion and second lead portions respectively extended from the second main portion, connected to the second external electrodes, and having a length increased in a direction towards the second main portion.