Throttle Valve Shaft Self-Cleaning for Vacuum Byproduct Buildup
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Solution Overview
Problem
Semiconductor fabrication processes under vacuum conditions face challenges with byproduct buildup on throttle valves, leading to reduced reliability and potential chuck failures, which affect the vacuum environment and processing tool yield.
Innovation Solution
A butterfly valve with a disc assembly and deflectors is used to direct cleaning gas through internal cavities and radial bores, reducing byproduct deposition on the shaft and improving valve reliability by implementing a method for cleaning the throttle valve during process operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a throttle valve is used to control vacuum conditions in semiconductor processing, then the vacuum environment is maintained, but byproduct buildup on the valve shaft occurs leading to reduced reliability
Solution Approach 1:
The valve shaft performs self-cleaning by directing process gas through internal cavities and openings to its ends, where the gas flow removes byproduct deposits. This self-service mechanism eliminates the need for external cleaning systems while maintaining valve reliability during continuous operation.
Solution Approach 2:
Process gas is directed through pneumatic flow through internal cavities and openings in the shaft to create a cleaning effect. The gas flow physically removes byproduct buildup from the shaft surfaces, preventing deposition-related failures.
2Productivity
If the throttle valve operates continuously under vacuum, then processing yield is maintained, but byproduct deposition increases leading to chuck failures
Solution Approach 1:
The valve shaft is designed with internal cavities and openings that enable preliminary cleaning action during normal operation. Gas flow is directed to the shaft ends before byproduct buildup can reach critical levels, preventing chuck failures and maintaining continuous productivity.
Solution Approach 2:
The continuous operation of the valve incorporates self-cleaning functionality where process gas automatically removes byproducts during each operational cycle, allowing uninterrupted processing while preventing deposition-related failures.
3Reliability
If gas flow is increased to clean the valve shaft, then byproduct removal is improved, but additional gas consumption occurs
Solution Approach 1:
The process gas serves dual functions: it maintains the vacuum processing environment and simultaneously cleans the valve shaft through controlled flow through internal cavities. This multi-functionality eliminates the need for separate cleaning gas supplies, reducing overall gas consumption.
Solution Approach 2:
The valve uses the existing process gas flow for self-cleaning purposes, eliminating the need for additional dedicated cleaning gas. The same gas that performs the processing function also removes byproducts, optimizing resource utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces byproduct buildup, enhancing the reliability of the throttle valve and maintaining consistent vacuum conditions, thereby improving the processing tool's yield and preventing chuck failures.
Implementation Method 1
A gas supply provides gas in an internal cavity defined in a shaft of the valve. The gas flow through the internal cavity and openings removes material from the shaft ends.
Data Source
AI summary
A valve for throttling gas flow from a semiconductor processing tool includes a valve body. A shaft extends through the valve body. The shaft defines an internal cavity and a first opening communicating with the internal cavity. A first deflector is positioned on the shaft proximate the first opening and directed at a first interface between the shaft and the valve body. A method for throttling gas flow from a semiconductor processing tool includes providing a gas in an internal cavity defined in a shaft of a valve and directing the gas through an opening defined in the shaft and communicating with the bore toward an interface between the shaft and a valve body of the valve supporting the shaft.