Through-Chip Via Power Saving Unit for Semiconductor Devices
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Solution Overview
Problem
The high capacitance in through-silicon vias (TSVs) of semiconductor devices leads to increased current consumption during data transmission, especially at low voltages and high speeds, resulting in elevated power consumption when multiple TSVs are driven.
Innovation Solution
A semiconductor device with a power-saving unit precharged to a precharge voltage, which is used to drive data through charge-sharing with a through-chip via, reducing power consumption by controlling the voltage level of the TSVs during data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If through-silicon vias (TSVs) are used to transmit data in stacked packages, then integration degree and signal transmission capability are improved, but power consumption increases due to high capacitance in the TSVs
Solution Approach 1:
The patent applies preliminary action by precharging the power-saving unit (capacitor) to a precharge voltage level before data transmission occurs. This precharging operation, controlled by the precharging unit during the precharge period, stores energy in advance so that when data needs to be transmitted through the TSV, the power-saving unit can immediately share its charge to reduce the power consumption spike that would otherwise occur during high-speed data transmission
2Speed
If multiple TSVs are driven at high speed, then data transmission performance is improved, but current consumption increases due to high capacitance
Solution Approach 1:
The patent introduces an intermediary power-saving unit (capacitor) that mediates between the power supply and the TSV during data transmission. The driving unit controls the voltage level of the TSV through charge-sharing with the precharged power-saving unit, acting as an energy buffer that reduces the direct power consumption demand on the supply system while enabling high-speed data transmission through the TSV
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces power consumption by precharging a power-saving unit and using charge-sharing to drive data, minimizing the increase in power consumption during data transmission in multi-chip packages with multiple TSVs.
Implementation Method 1
a power-saving unit suitable for being precharged to a precharge voltage level based on a voltage level of the first through-chip via
Implementation Method 2
a precharging unit suitable for inverting a voltage level of the first through-chip via during the precharge period, and shifting the voltage level to the precharge voltage
Implementation Method 3
a driving section suitable for controlling the voltage level of the first through-chip via through charge-sharing with the precharged voltage level of the power saving unit
Data Source
AI summary
A semiconductor device includes a plurality of chips; a first through-chip via vertically passing through the chips, a power-saving unit suitable for being precharged to a precharge voltage during a precharge period; and a driving unit suitable for driving data using the precharge voltage outputted from the power-saving unit, during a driving period.