Through Conductor Arrangement in Sealing Body for Signal Transmission
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Solution Overview
Problem
Existing electronic devices with semiconductor components face limitations in signal-transmitting and power supply transmission characteristics, which affect overall performance and heat dissipation, particularly in compact designs where space for heat dissipation components is limited.
Innovation Solution
The electronic device design features a sealing body with a specific arrangement of through conductors, where the number is highest in the second region and lowest in the fourth region, optimizing the layout to reduce signal and power supply path lengths and enhance heat dissipation by positioning the logic chip between memory components, thus improving transmission characteristics and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If semiconductor components are mounted on both sides of a wiring substrate to shorten signal-transmitting paths, then signal transmission quality is improved, but transmission characteristics of power supply paths and signal paths deteriorate due to increased complexity in conductor arrangement
Solution Approach 1:
The patent applies local quality by differentiating the arrangement density of through conductors across different regions of the sealing body. Specifically, the second region (peripheral area) contains the highest number of through conductors, the third region (between second and first regions) contains a medium number, and the fourth region (between second and third regions) contains the lowest number. This non-uniform distribution optimizes both signal transmission quality and power supply characteristics by placing more conductors where they are most needed for electrical connection while maintaining manageable complexity.
2Reliability
If the number of through conductors is increased to improve electrical connection, then transmission characteristics are improved, but heat dissipation becomes more difficult due to limited space in compact designs
Solution Approach 1:
The patent utilizes the vertical dimension by forming through conductors that extend through the thickness of the sealing body, enabling electrical connections between upper and lower semiconductor components mounted on opposite surfaces. This three-dimensional conductor arrangement allows for improved transmission characteristics without increasing the planar footprint, thereby maintaining compact device dimensions while effectively managing heat dissipation through optimized spatial utilization.
3Volume of moving object
If semiconductor components are positioned closer together to achieve miniaturization, then device size is reduced, but transmission loss increases due to longer power supply paths
Solution Approach 1:
The patent segments the conductor arrangement into multiple regions with different densities of through conductors. The second region (peripheral area) contains the highest density of through conductors to provide multiple parallel power supply and signal transmission paths, reducing transmission loss. The third region contains a medium density, and the fourth region contains the lowest density. This segmented approach allows miniaturization while maintaining low transmission loss through optimized regional conductor distribution.
Data Source
AI summary
The electronic device includes first and second semiconductor components. And, the electronic device includes a sealing body for sealing the first semiconductor component (i.e., the logic chip). A plurality of through conductors electrically connected to the first semiconductor component and/or the second semiconductor component is formed in the sealing body. In plan view, the sealing body has a first region in which the first semiconductor component is located, a second region located on a periphery of a first surface of the sealing body, a third region located between the second region and the first region, and a fourth region located between the second region and the third region. The plurality of through conductors is arranged most in the second region. The number of the plurality of through conductors located in the third region is larger than the number of the plurality of through conductors located in the fourth region.