Through-Dielectric Via Layout for Dense Die Stack Thermal Control
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Solution Overview
Problem
High-density semiconductor devices face challenges with thermal regulation due to increased heat generation from dense circuitry, requiring effective heat dissipation and power distribution while maintaining spatial constraints.
Innovation Solution
Implementing a through dielectric via within the semiconductor device that extends through dielectric material to the top semiconductor die, allowing for power distribution and heat dissipation, and using dielectric material to bond multiple stacks of semiconductor dies, enhancing thermal regulation and reducing complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple stacks of semiconductor dies are coupled with dense circuitry to increase device density, then the functionality and integration of the semiconductor device is improved, but heat generation increases and thermal regulation becomes difficult
Solution Approach 1:
The patent divides the semiconductor device into multiple stacks of dies that are laterally separated and coupled to different locations of the semiconductor die. This segmentation allows heat to be distributed across multiple attachment points rather than concentrated in one location, improving thermal regulation while maintaining high device density.
Solution Approach 2:
The patent transitions from conventional two-dimensional planar arrangements to three-dimensional vertical stacking with lateral distribution. Multiple stacks are positioned at different lateral locations on the semiconductor die, creating a three-dimensional architecture that improves both density and thermal management by distributing heat sources in multiple spatial dimensions.
2Temperature
If the top semiconductor die is used to dissipate heat, then thermal regulation is improved, but power distribution to the top die becomes complex
Solution Approach 1:
The top semiconductor die serves multiple functions simultaneously: it acts as a heat dissipation element through its attachment to the heat sink, while also receiving power and signal connections through the through-dielectric via. This multi-functionality simplifies the overall device architecture by eliminating the need for separate heat spreading layers while maintaining effective thermal management.
Solution Approach 2:
The through-dielectric via acts as an intermediary structure that penetrates the dielectric material to provide direct electrical connection to the top semiconductor die. This intermediary pathway simplifies power distribution by establishing a direct route through the dielectric rather than requiring complex lateral routing through multiple interconnect layers.
3Reliability
If conventional packaging processes are used to encapsulate dies, then protection from environmental factors is achieved, but the process is time-consuming and complex
Solution Approach 1:
The patent merges the encapsulation function with the heat dissipation structure by integrating the heat sink attachment process with the packaging process. The dielectric material and encapsulant are applied in a unified process that simultaneously provides environmental protection and thermal management, reducing the number of separate processing steps and overall packaging time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The through dielectric via effectively dissipates heat and provides power to the top semiconductor die, addressing thermal regulation challenges and reducing the complexity and cost of the semiconductor device assembly.
Implementation Method 1
using dielectric material to bond multiple stacks of semiconductor dies
Implementation Method 2
The through dielectric via effectively dissipates heat
Implementation Method 3
the through dielectric via provides power to the top semiconductor die
Data Source
AI summary
A semiconductor device with a through dielectric via is disclosed. The semiconductor device assembly can include a semiconductor die and multiple stacks of semiconductor dies coupled with the semiconductor die at different lateral locations. Dielectric material can be disposed at the semiconductor die between the multiple stacks of semiconductor dies. The through dielectric via can extend entirely through the dielectric material to the semiconductor die such that the through dielectric via couples with circuitry at the semiconductor die. In this way, the through dielectric via can provide power to the semiconductor die (e.g., exclusive of the multiple stacks of semiconductor dies).