Through-Electrode Substrate Capacitor Layout for Insulation and Stress Relief
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Solution Overview
Problem
Current electronic devices with through electrode substrates face challenges in efficiently connecting conductive layers across the substrate, leading to issues such as short-circuiting and reduced capacitance due to the lack of effective insulation and stress management between conductive layers.
Innovation Solution
A through electrode substrate is designed with a MIM (Metal-Insulator-Metal) structure, featuring a substrate with a first and second surface, through electrodes, and conductive layers, where an insulating layer is sandwiched between the conductive layers, and a ground layer is used to alleviate stress and prevent short-circuiting, with specific configurations of the insulating and conductive layers to enhance insulation and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive layers are connected through the substrate using through electrodes, then electrical connection between surfaces is improved, but short-circuiting between conductive layers occurs due to insufficient insulation
Solution Approach 1:
An insulating layer is introduced as an intermediary between the first conductive layer and the second conductive layer. This insulating layer prevents direct electrical contact between the conductive layers while allowing the through electrodes to maintain electrical connection through the substrate, thereby resolving the short-circuiting issue without compromising electrical connectivity.
Solution Approach 2:
The space between conductive layers is segmented into distinct functional zones: a first insulating layer separates the conductive layers to prevent short-circuiting, while a second insulating layer covers side surfaces of through electrodes. This segmentation allows each insulating layer to perform its specific insulation function independently, ensuring reliable electrical connection without short-circuiting.
2Area of stationary object
If conductive layers are positioned close to each other for compact design, then device area is reduced, but capacitance decreases due to insufficient insulation between layers
Solution Approach 1:
The patent employs a composite insulation structure combining two different insulating layers with distinct functions. The first insulating layer provides dielectric separation to maintain capacitance, while the second insulating layer provides mechanical protection and additional insulation on side surfaces. This composite approach allows compact layer spacing without sacrificing capacitance or risking short-circuiting.
3Reliability
If through electrodes are used to connect conductive layers, then electrical conductivity is improved, but stress concentration occurs leading to structural instability
Solution Approach 1:
The second insulating layer acts as a mediator that covers the side surfaces of the through electrodes. This layer distributes mechanical stress along the electrode interfaces, preventing stress concentration that would otherwise lead to structural instability. The through electrodes maintain their electrical conductivity function while the insulating layer ensures structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short-circuiting between conductive layers, improves capacitance, and reduces stress-related issues, enabling efficient signal transmission and reliable electrical connections in electronic devices.
Implementation Method 1
an insulating layer arranged on the first conductive layer... The insulating layer includes a first part arranged between the first conductive layer and the second conductive layer
Implementation Method 2
A through electrode substrate according to claim 1, wherein the through electrode substrate includes a first capacitor arranged on a first surface side of the substrate
Data Source
AI summary
A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.