Semiconductor Substrate Layout Using Through Electrodes for Dense Displays
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Solution Overview
Problem
In display devices, the increasing number of light emitting elements and drive circuits on a single substrate leads to a larger mounting area and complex wire management, making miniaturization and cost-effective manufacturing challenging.
Innovation Solution
A semiconductor device design where the drive circuit is on one surface of the substrate and light emitting elements are on the other, connected via a through electrode that penetrates the substrate, reducing the need for surface-level wire connections and allowing for miniaturization without the use of an interposer substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If light emitting elements and drive circuit are mounted on one substrate to perform active driving, then driving accuracy is improved, but mounting area increases
Solution Approach 1:
The patent transitions from a planar mounting approach to a three-dimensional structure by having the drive circuit and light emitting elements located on opposite surfaces of the substrate. This vertical arrangement allows electrical connection through through-substrate conductors, effectively utilizing the Z-dimension to reduce the footprint area while maintaining all necessary functional connections for active driving
2Measurement precision
If pixel count is increased, then display resolution is improved, but number of wires increases and wire leading becomes more complicated
Solution Approach 1:
By moving the drive circuit to the opposite surface and using through-substrate conductors, the patent eliminates the need for complex surface-level wire routing. This three-dimensional connection approach significantly reduces wire management complexity while enabling higher pixel counts and display resolution
Solution Approach 2:
The patent integrates multiple functions into the substrate structure itself - the substrate serves as both the mechanical support and the electrical interconnection medium through its through-substrate conductors. This merging of structural and electrical functions simplifies the overall system and reduces the number of separate wire connections needed
3Measurement precision
If pixel count is increased, then display resolution is improved, but mounting area becomes larger
Solution Approach 1:
The patent employs a three-dimensional arrangement where the drive circuit is positioned on the opposite surface from the light emitting elements, connected via through-substrate conductors. This vertical integration allows for higher pixel density without proportionally increasing the mounting area, as the electrical connections occupy the Z-dimension rather than consuming additional planar space
Data Source
AI summary
Provided is a semiconductor device including a drive circuit which is provided on one surface of a semiconductor substrate and drives a light emitting element, one of or a plurality of the light emitting elements which is provided on another surface of the semiconductor substrate, and a through electrode which penetrates the semiconductor substrate and electrically connects the drive circuit with the light emitting element.