Through-Electrode Substrate MIM Capacitor for Short-Circuit Isolation
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Solution Overview
Problem
Current electronic devices with through electrode substrates face challenges in efficiently connecting conductive layers across substrates due to issues like short-circuiting and signal transmission loss, particularly in high-frequency applications where precise insulation and conductive layer alignment are critical.
Innovation Solution
A through electrode substrate with a Metal-Insulator-Metal (MIM) structure is developed, featuring a substrate with through electrodes, a first conductive layer, an insulating layer, and a second conductive layer, where the insulating layer is strategically positioned between the conductive layers to prevent short-circuiting and enhance signal transmission, using materials like silicon nitride and silicon oxynitride for high specific permittivity and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive layers are connected through a substrate using through electrodes, then electrical connection between surfaces is achieved, but short-circuiting between conductive layers may occur
Solution Approach 1:
An insulating layer is introduced as an intermediary between the first conductive layer and the second conductive layer. This insulating layer prevents direct electrical contact between the conductive layers, thereby eliminating the short-circuiting risk while maintaining the through-electrode connection structure.
Solution Approach 2:
The space between conductive layers is segmented by introducing a distinct insulating layer. This segmentation creates separate electrical zones, ensuring that the first conductive layer and second conductive layer remain electrically isolated while still being part of the same physical structure.
2Reliability
If insulating material is added between conductive layers to prevent short-circuiting, then electrical isolation is improved, but device complexity increases
Solution Approach 1:
The insulating layer serves multiple functions simultaneously: it provides electrical isolation between conductive layers, acts as a structural support element, and facilitates the overall device assembly process. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
3Ease of operation
If through electrodes are used to connect wirings on both surfaces, then signal transmission between surfaces is enabled, but signal transmission loss increases in high-frequency applications
Solution Approach 1:
The electrical parameters of the through-electrode path are optimized by controlling the insulation properties and dimensional parameters of the insulating layer. This ensures minimal signal attenuation and impedance mismatch, thereby reducing signal transmission loss in high-frequency applications while maintaining bidirectional signal transmission capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MIM structure effectively prevents short-circuiting between conductive layers, improves signal transmission, and maintains high-frequency signal integrity by using a dielectric layer with specific thickness and coverage to manage stress and thermal expansion differences between materials.
Implementation Method 1
an insulating layer arranged on the first conductive layer... The insulating layer includes a first part arranged between the first conductive layer and the second conductive layer
Implementation Method 2
maintains high-frequency signal integrity by using a dielectric layer with specific thickness and coverage to manage stress and thermal expansion differences between materials
Data Source
AI summary
A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.