Through Electrode Density via Nested Columnar Plugs
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Solution Overview
Problem
Conventional semiconductor technologies face challenges in achieving high-density through electrodes while minimizing parasitic capacitance and maintaining miniaturization, as existing configurations require significant space and are inefficient in plug arrangement.
Innovation Solution
The implementation of a semiconductor device with a semiconductor substrate featuring a through hole filled with an insulating film and multiple columnar electrically conducting plugs, allowing for higher density packing and efficient electrical connections by burying plugs within the insulating film, which reduces the need for multiple through holes and enhances integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If one plug corresponds to one interconnect configuration is used, then the structure is simple and easy to manufacture, but the density of arranged plugs is low and parasitic capacitance reduction is difficult
Solution Approach 1:
The patent merges multiple plugs (first plug and second plug) into a single through electrode structure, where multiple columnar electrically conducting plugs are arranged within one through hole. This combining approach increases plug density without proportionally increasing the number of through holes, thereby improving electrical connection efficiency while controlling structural complexity.
Solution Approach 2:
The patent implements a nested structure where multiple columnar plugs are positioned within a single through hole, with insulating films filling the spaces between them. This nesting arrangement allows multiple electrical connections to share a common through-hole pathway, maximizing space utilization and achieving high-density electrode arrangement.
2Area of stationary object
If conventional through electrode configurations are used, then manufacturing is straightforward, but area efficiency is poor and integration density is limited
Solution Approach 1:
The patent combines multiple through electrodes into a single integrated structure with multiple columnar plugs arranged within one through hole. This merging reduces the total number of through holes required, improving area efficiency and enabling higher integration density while maintaining manufacturing feasibility through standardized fabrication processes.
Solution Approach 2:
The patent transitions from a conventional one-to-one plug-to-hole mapping to a many-to-one configuration where multiple plugs share a single through hole. This dimensional reorganization in the vertical arrangement allows multiple electrical connections to be packed more efficiently within the substrate thickness, improving area utilization.
3Reliability
If multiple through holes are used for multiple plugs, then each plug has dedicated connection path, but the area requirement increases and integration density decreases
Solution Approach 1:
The patent merges multiple electrical connection paths into a single through hole structure, where multiple columnar plugs are vertically or radially arranged within the same through hole. This approach maintains dedicated electrical pathways for each plug while sharing the common through-hole infrastructure, thereby reducing substrate area requirements while preserving connection reliability.
Solution Approach 2:
The patent resolves the area-reliability contradiction by moving connection paths into the vertical dimension. Multiple plugs are arranged along the vertical axis within a single through hole, allowing each plug to maintain its own electrical pathway while sharing the horizontal footprint of a single through hole, thus reducing substrate area while ensuring reliable connections.
Data Source
AI summary
The layout density of the through electrodes in the horizontal plane of the substrate is enhanced. Through holes 103 extending through the silicon substrate 101 is provided. An insulating film 105 is buried within the through hole 103. A plurality of columnar through plugs 107 are provided in the insulating film 105.