Through Electrode Substrate Layout for Higher Packaging Density
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Solution Overview
Problem
Conformal vias in through electrode substrates occupy surface area, preventing elements like LSI chips from being placed on areas with through holes, limiting packaging density.
Innovation Solution
A through electrode substrate design with a through electrode having a first part along the sidewall and a second part coplanar with the substrate surface, allowing elements to be placed on through hole areas, and a manufacturing method involving a sealing layer and electroconductive layer connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conformal via structure is used for through electrodes, then the through electrode can be formed on the substrate surface, but the surface area is occupied and elements cannot be placed on areas with through holes
Solution Approach 1:
The through electrode structure transitions from a two-dimensional surface occupation (conformal via) to a three-dimensional configuration where the electrode extends through the substrate thickness. The coplanar surface allows element placement by utilizing the vertical dimension for electrode connection while maintaining horizontal surface availability.
Solution Approach 2:
The through electrode is segmented into distinct parts: a first part along the sidewall providing structural support and electrical connection, and a second part coplanar with the substrate surface enabling element placement. This segmentation allows different functional regions to coexist without mutual interference.
2Reliability
If through holes are provided in the substrate for through electrodes, then electrical connection is achieved, but the surface area for element placement is reduced
Solution Approach 1:
The through electrode structure nests the electrical connection function within the substrate thickness while maintaining surface availability. The electrode path is nested through the substrate volume rather than occupying surface area, allowing elements to be placed on the coplanar surface while electrical connections are established through the nested through-hole structure.
3Reliability
If the through electrode spreads along the substrate surface, then electrical connection is improved, but manufacturing time increases
Solution Approach 1:
The sealing layer is formed in advance to block through holes before through electrode formation. This preliminary action defines the electrode formation area and facilitates subsequent electrode deposition processes, reducing overall manufacturing time while ensuring reliable electrical connections through the through-hole structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient use of substrate surface area by allowing elements to be positioned on through hole areas, increasing packaging density and reducing manufacturing time.
Implementation Method 1
a sealing layer blocking the through hole is provided on the first surface of the substrate
Implementation Method 2
a wiring layer having an electroconductive layer connected to the second part of the through electrode
Data Source
AI summary
A manufacturing method of a through electrode substrate includes: a step of preparing a substrate including a first surface and a second surface positioned oppositely to the first surface, and provided with a through hole; a step of providing a sealing layer blocking the through hole on the first surface of the substrate; an electrode forming step of forming a through electrode inside the through hole, the through electrode having a fist part extending along a sidewall of the through hole, and a second part connected to the first part and spreading along the sealing layer; and a step of removing the sealing layer.