Through-Electrode Substrate with Base-Covered Edge
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Solution Overview
Problem
Conventional through-electrode substrates face structural instability and connection defects due to gaps generated between the through-electrode and the base, leading to broken wiring and reduced reliability.
Innovation Solution
A through-electrode substrate design where the periphery edge of the through-electrode is covered by the base, with a manufacturing method involving isotropic etching and a mask to prevent base wear, ensuring structural stability and preventing gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the through-electrode is formed by filling a conductive material into a through-hole by electrolytic plating, then the through-electrode can be manufactured, but gaps are generated between the through-electrode and the base leading to structural instability
Solution Approach 1:
A convex part is formed on the inner wall of the through-hole before filling the conductive material. This preliminary structural modification ensures that when the conductive material is deposited by electrolytic plating, it adheres to the convex part which acts as an anchor, preventing gap formation between the through-electrode and base while maintaining ease of manufacture
Solution Approach 2:
The convex part is formed at a specific location on the inner wall of the through-hole, creating a localized region with enhanced adhesion properties. This local structural modification concentrates the bonding strength at critical points, ensuring structural stability without requiring complete redesign of the entire through-hole structure
2Ease of operation
If the periphery edge of the through-electrode is exposed from the base, then the through-electrode is accessible for connection, but the base wears and gaps form reducing connection reliability
Solution Approach 1:
The convex part is formed on the inner wall before the through-electrode is fully deposited. This preliminary structure ensures that as the conductive material builds up, it adheres to the convex part which prevents the periphery edge from being exposed, thereby preventing base wear and gap formation while maintaining connection reliability
Solution Approach 2:
The convex part acts as a cushioning structure that prevents direct contact and potential damage between the through-electrode periphery edge and the base. By providing this protective structure in advance, the design prevents wear and gap formation that would otherwise occur during assembly and operation, enhancing connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a structurally stable through-electrode substrate with improved connection reliability by preventing base wear and gap formation, thus enhancing the integrity of the wiring and adhesion.
Implementation Method 1
A through-electrode is formed in such a through-electrode substrate by filling a conductive material into a through-hole by electrolytic plating
Implementation Method 2
etching the second surface of the base in a state arranged with the mask, exposing a part of the inner side region of the electrode, and leaving a part of the base at the periphery edge of the electrode
Data Source
AI summary
A through-electrode substrate includes a base including a first surface and a second surface mutually opposing each other, and a through-electrode arranged in a through-hole passing through the second surface from the first surface of the base, wherein the through-electrode includes an first end surface of the first surface side and an second end surface of the second surface side exposed from the base in the first surface and the second surface, and a periphery edge of one or both of the first end surface of the first surface side and the second end surface of the second surface side is covered by a part of the base.