Through Electrode Substrate Gas Discharge Design
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Solution Overview
Problem
Conventional through electrode substrates experience blow-off phenomena and cracking during annealing due to gas or water expansion from conductive materials, complicating manufacturing processes and limiting effective gas discharge.
Innovation Solution
A conductive material filled through hole substrate with a projection part and depression part design, where the depression part forms a gap to effectively discharge gases and water, and a gas discharge part or insulation layer covers the boundary between the through electrode and ground conductive layer, facilitating efficient gas removal without increasing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through electrode substrate is formed by filling conductive material into a through hole by electrolytic plating, then electrical conduction between front and rear surfaces is achieved, but gas or water expansion during heat treatment causes blow-off phenomena and cracking in insulation layers
Solution Approach 1:
The patent extracts the harmful gas and water components from the conductive material by providing dedicated discharge paths (through holes or gaps) that lead to the exterior of the substrate. This allows the gas and water to be removed before they can cause blow-off or cracking during heat treatment, while maintaining the electrical conduction function of the through electrode.
Solution Approach 2:
The patent introduces an intermediary structure (gas discharge path or gap) between the conductive material and the surrounding insulation layer. This intermediary provides a controlled channel for gas and water expansion, preventing uncontrolled blow-off while allowing the through electrode to maintain its electrical conduction function.
2Ease of manufacture
If conventional through hole design is used, then manufacturing process is simple, but gas discharge is ineffective leading to manufacturing defects
Solution Approach 1:
The patent incorporates gas discharge paths or gaps into the through hole design during the manufacturing process, before heat treatment occurs. This preliminary structural preparation ensures that when gas and water expansion occurs during subsequent heat treatment, there are already established pathways for discharge, preventing defects and improving substrate yield without adding significant manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively discharges gases and water from the conductive material during heat treatment, preventing blow-off and cracking, improving substrate yield and reliability while maintaining structural stability.
Implementation Method 1
The cause of these phenomena is due to the expansion of a gas component or water component included in a conductive material during a heat treatment
Implementation Method 2
forming a depression part keeping a gap between the through hole and the through electrode
Data Source
AI summary
The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode.